Full Job Description
Drive performance, reliability, and capability of dry etch equipment in a high volume semiconductor environment. Lead sustaining operations, tool health management, and cross functional collaboration to maintain high availability and output quality. Optimize tool diagnostics and KPIs. Perform advanced troubleshooting across mechanical, electrical, software, and plasma systems. Own PM strategy, including procedure development, cycle time reduction, training, and chronic issue mitigation. Lead excursion containment and recovery; apply FMEA, 8D, Fishbone, and SPC to drive root cause elimination. Communicate risks and corrective actions to engineering and manufacturing teams. Partner with process engineering to improve robustness, uniformity, repeatability, and CD control. Execute chamber matching, hardware tuning, recipe stabilization, DOE work, and plasma stability optimization. Support installs, conversions, upgrades, and retrofits. Collaborate with OEMs on chronic issues, hardware/software improvements, and roadmap alignment. Promote TPM through workstation health, MTAGs, and continuous improvement standards. Develop best practices, documentation, and training for shift consistency. Build SPC/FDC strategies for chamber stability and drift detection. Report on tool availability, variability, cost reduction, and chronic issue status. Improve yield through defect reduction, stability improvements, plasma tuning, and consumables optimization. Reduce cost of ownership by extending consumable life, minimizing unplanned PMs, and improving MTBC. Qualify new materials/components and train technicians and junior engineers on PMs, troubleshooting, and equipment health strategy.
Employer will accept a Master's degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related field and 3 years of experience in the job offered or related occupation.
Position requires:
1. Plasma physics and plasma-material interactions
2. Process-equipment interactions
3. Thermodynamics, heat transfer, and fluid dynamics
4. Vacuum systems and RF power delivery systems
5. Endpoint systems, pumps, valves, robotics, and thermal control systems
6. Equipment maintenance and troubleshooting
7. Advanced data analytics and SPC using Python and JMP
8. FDC and DOE methodology
9. SEM/EDX, profilometry, ellipsometry, and metrology integration
10. Material characterization techniques including FTIR and XPS
The US base salary range that Micron Technology, Inc. estimates it could pay for this full-time position is $163,000.00 - $216,000.00.For additional pay & benefits information, please refer to the requisition at Micron.com/careers.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
