Engineer/Principal Engineer RF Microwave/Mixed Signal Design Engineer

What You'll Get to Do

The Airborne Multifunction Sensors (AMS) Engineering and Sciences (E&S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.

We are seeking engineers with experience and interest in electronic assembly and packaging design. Roles and responsibilities include, but are not limited to, the following:

• Designing, modeling, and verifying RF and mixed signal assembly product types including apertures, radome, circulators/isolators, Transmit/Receive modules and switches, interposer assemblies, filters, RF manifolds/splitters, backplanes, beamformers, and other relevant RF building blocks within RF antenna subsystem.
• Designing, modeling, and verifying RF and mixed signal subsystems products including Active Electronically Scanned Array (AESA) and other RF Subsystem products within an electronic sensor system like a Radar.
• Using industry design tools for modeling and simulating RF and mixed signal performance.  Tools include but are not limited to: ANSYS EM Suite, CST Microwave, Keysight ADS, Genesys, Matlab/Simulink, Xpedition, DXDesigner, TICRA/GRASP, FEKO, Python/C++/C#, Github, Labview.
• RF and mixed signal hardware test planning and test specification creation
• RF and mixed signal hardware production follow, engineering troubleshoot and sustainment engineering.

• Prototyping RF and mixed signal hardware with standard RF test equipment such as RF lab equipment such as vector network analyzers, spectrum analyzers, digital oscilloscopes, signal generators, phase noise test sets, and power meters.
• Antenna measurements using anechoic chambers and antenna range test equipment.

• Deriving and trading requirements from antenna subsystem-level down through component levels.
• Managing RF budgets, frequency planning, and common assembly level interfaces.
• Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
• Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test Design.
• Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full-rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
• Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
• Supporting products throughout the product life cycle

**This role is contingent upon Program Award.

**This role is contingent upon the ability to obtain an Interim US Government Secret Clearance prior to start.

This requisition can be filled at either the Engineer (T02) or Principal Engineer (T03) level based on the below requirements.

Engineer (T02) Basic Qualifications:

• Bachelor's degree in Electrical Engineering or related STEM field with 2 years of RF/microwave experience -OR- a Master’s degree in Electrical Engineering or related STEM field with 0 years of RF/microwave experience
• Demonstrated knowledge of electrical engineering design software and equipment
• Experience in a collaborative, cross-functional team environment
• US Citizenship is required
• The ability to obtain and maintain a U.S. Government Secret clearance. An active U.S. Government Interim Secret clearance is required prior to start.

T03 Principal Engineer Basic Qualifications:

• Bachelor's degree in Electrical Engineering or related STEM field with 5 years of RF/microwave experience -OR- Master’s degree in Electrical Engineering or related STEM field with 3 years of RF/microwave experience -OR- a PhD degree in Electrical Engineering or related STEM field.
• Demonstrated knowledge of electrical engineering design software and equipment
• Experience in a collaborative, cross-functional team team environment
• US Citizenship is required
• The ability to obtain and maintain a U.S. Government Secret clearance. An active U.S. Government Interim Secret clearance is required prior to start.

Preferred Qualifications:

• Graduate degree concentration in RF/Microwave Engineering or Computational Electromagnetics
• Direct experience with Receiver Exciter (REX) hardware designs including receivers, waveform generators, master oscillators, reference generators, RF converters, and similar backend REX hardware.
• Direct experience designing or testing AESA / phased array, Radar, SIGINT, or SATCOM products
• Experience working in DoD Radar electronic designs through all phases of a product’s lifecycle from concept through production support
• Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip, interposers
• Electronic troubleshooting from component to assembly levels
• Demonstrated ability to write code to conduct complex data reduction and analysis using Matlab or Python/C++/C#
• Technical team leadership experience
• Current, active US Government Secret clearance or higher.

What We Can Offer You

Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family.  

Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!