Bachelor's degree in Electrical or Mechanical Engineering or related field.
Experience with CAD or similar software for technical drawings.
Strong verbal and written communication skills.
Ability to manage multiple tasks with minimal supervision.
Self-motivated and detail-oriented, with teamwork skills.
Proven ability to meet deadlines in a fast-paced environment.
Responsibilities
Design laminate (BGA) and wafer-level semiconductor packages based on requirements.
Create detailed engineering drawings with minimal supervision.
Analyze and resolve design challenges using engineering principles.
Identify opportunities to enhance design methodologies and processes.
Make informed design-related decisions and recommendations.
Build partnerships with customers and cross-functional teams.
Collaborate with Product Group and Sales teams to meet customer needs.
Benefits
Hybrid work schedule.
Opportunities for continuous learning and professional development.
Supportive team environment focused on quality and productivity.
Full Job Description
Position Summary:
Amkor Technology is seeking an IC Package Design Engineer for its Tempe, Arizona location. This role is responsible for developing high-quality IC package designs, creating detailed engineering drawings, and supporting multiple design-related activities within the Design Center. The engineer collaborates with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements.
Essential Duties and Responsibilities:
Design laminate (BGA) and wafer-level semiconductor packages, including determination of design rules, optimization, verification, and package selection based on thermal, mechanical, and electrical requirements.
Create accurate and detailed engineering drawings with minimal supervision.
Analyze and resolve design challenges and customer-related technical issues using sound engineering principles.
Identify opportunities to improve design methodologies, processes, and technologies.
Exercise sound judgment when making design-related decisions and recommendations.
Build and maintain effective partnerships with customers and cross-functional teams to support quality and productivity objectives.
Collaborate with Amkor Product Group and Sales teams to ensure customer requirements are understood and achieved.
Interface with internal and external customers to support design reviews, technical discussions, and project execution.
Prepare technical documentation and maintain accurate engineering records.
Demonstrate a continuous learning mindset and contribute positively to team development and knowledge sharing.
Perform other duties as assigned.
Required Qualifications:
Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
Experience using CAD or similar engineering software to create and maintain technical drawings.
Strong verbal and written communication skills.
Ability to manage multiple tasks and complete assignments effectively with minimal supervision.
Self-motivated, detail-oriented, and able to work collaboratively in a team environment.
Demonstrated ability to meet project deadlines and manage priorities in a fast-paced setting.
Preferred Qualifications:
Experience in semiconductor packaging design.
Experience using package design and simulation tools such as Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350.
PCB design experience.
Working knowledge of Geometric Dimensioning and Tolerancing (GD&T) practices.
Signal Integrity (SI) and Power Integrity (PI) analysis experience.
Location:
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Please note: This position may require access to export-controlled information. Candidate must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) or be eligible to qualify for a U.S. Government export authorization.
About Amkor Technology
Amkor Technology is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania, United States. The company was founded in 1968 and has more than 30,000 employees worldwide and a reported $4.2 billion in revenue for 2018. Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. The company offers semiconductor design, wafer fabrication, assembly and test services. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in Asia, Europe and the United States. The company's customers include integrated device manufacturers, fabless semiconductor companies and contract foundries. Amkor Technology was founded in 1968 and became a public company in 1998.
