Electrical CAD and Manufacturing Lead, Robotics Hardware Engineering

Meta

$145K — $175K *
Telecommunications & Hardware
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 7+ years of PCB layout design and manufacturing experience
  • Associates degree in Electrical Engineering or equivalent
  • Expert proficiency in Cadence Allegro
  • Experience across multiple PCB technologies: HDI, rigid, flex, and rigid-flex
  • Strong knowledge of IPC, JEDEC, and other manufacturing standards
  • Proficiency in creating full documentation packages for PCB designs
  • Strong communication and organizational skills

Responsibilities

  • Lead complex, multi-layer PCB layouts for robotic subsystems
  • Own the PCB manufacturing process from design to delivery
  • Perform DFM/DFA reviews and propose design optimizations
  • Manage schematic symbol and PCB footprint libraries
  • Review and validate netlist-to-layout constraint mapping
  • Coordinate with external PCB design resources during surges
  • Drive vendor strategy for PCB fabrication and assembly
  • Establish and improve processes for design release and documentation

Benefits

  • Opportunity to lead significant projects in robotics
  • Collaborative environment focused on innovation and rapid prototyping
  • Chance to mentor and recruit a talented engineering team
  • Exposure to a diverse portfolio of robotic subsystems
  • Potential for involvement in cutting-edge technologies and practices
Full Job Description
Meta Robotics Studio is seeking an Electrical CAD and Manufacturing Lead. This role is pivotal in owning the full lifecycle of printed circuit board design, fabrication, and assembly - from multi-layer layout through DFM/DFA optimization, vendor coordination, and delivery of production-quality hardware to internal engineering teams. You will lead PCB design efforts across a diverse portfolio of robotic subsystems (power distribution, motor controllers, perception, main logic, sensor interfaces) while establishing and maintaining design standards, library infrastructure, and manufacturing processes that enable rapid, high-quality prototype iteration. Candidates should be comfortable working in a high ambiguity, fast-paced environment where full system requirements are seldom known. This team is dedicated to building hardware that enables learning through data collection and system testing. Responsibilities Lead and execute complex, multi-layer PCB layouts for robotic subsystems spanning high-speed digital, mixed-signal analog, power electronics, and RF domains across rigid, flex, and rigid-flex substrates • Own the end-to-end PCB manufacturing process from design rule definition through fabrication, assembly, and delivery - acting as the primary liaison between design engineering, component engineering, and external PCB fabrication/assembly vendors • Perform and lead DFM/DFA reviews, proposing design optimizations for manufacturability, yield, and reliability; establish and maintain standardized design rules, stack-up libraries, and process qualification criteria • Manage schematic symbol and PCB footprint libraries; ensure data integrity, version control, and compliance with internal standards and IPC/JEDEC specifications • Review and validate netlist-to-layout constraint mapping, ensuring design intent is accurately captured in physical implementation; resolve signal integrity, power integrity, thermal, and EMI challenges through placement, routing, and stackup • Coordinate and manage external PCB design resources during design surges; review and approve third-party layout work for quality and compliance • Drive vendor strategy for PCB fabrication and assembly - qualify new suppliers, negotiate capabilities, manage technical queries (TQs/EQs), and oversee build schedules across multiple concurrent projects • Establish and improve processes for design release, archival, BOM management, and documentation packages (fabrication drawings, assembly drawings, pick-and-place files, test points) • Recruit, mentor, and manage the design quality of engineers on the team Minimum Qualifications • 7+ years of experience in PCB layout design and manufacturing engineering, with demonstrated leadership of complex multi-layer board designs from concept through production • Associates degree in Electrical Engineering, Electrical Engineering Technology, or equivalent experience • Expert proficiency in Cadence Allegro, including constraint management, impedance-controlled routing, and design rule configuration • Experience across multiple PCB technologies: HDI, rigid, flex, and rigid-flex • Experience designing high-speed differential circuits, power distribution networks, analog signal chains, and RF circuits with appropriate isolation and grounding strategies • Strong working knowledge of IPC, JEDEC, and other electronic manufacturing standards • Experience managing PCB fabrication and assembly vendor relationships, including stack-up negotiation, material selection, DFM resolution, and build coordination • Experience creating and maintaining schematic symbols, PCB footprints, and component libraries in enterprise library management systems • Proficiency in creating complete documentation packages: fabrication drawings, assembly drawings, BOM, and Gerber/ODB++ outputs • Proficiency in ECAD/MCAD collaboration workflows (3D model exchange, board outline coordination) • Strong communication and organizational skills with proven ability to manage multiple concurrent projects and stakeholders Preferred Qualifications • Experience with Altium Designer • BS degree in Electrical Engineering, Electrical Engineering Technology, or equivalent experience • Experience with high-power PCB design and interfaces (wire bonding, high copper weight, and aluminum-backed designs), motor drive electronics, and power stage layout • Experience in robotics, automotive, consumer electronics, or server/data center hardware development environments • Experience establishing DFM/DFA frameworks and design rule standardization across an engineering organization • 12+ years of experience in PCB design, with progressive responsibility including team leadership and process ownership • Experience with version control systems and PLM/document control workflows for design release • Experience with signal and power integrity simulation tools (HyperLynx, Ansys SIwave, or equivalent) • Experience coordinating external contract manufacturers

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