Req ID: 141918
Remote Position: No
Region: Americas
Country: USA
State/Province: Texas
City: Richardson
SummaryThe Director of the CRT3 Technology CoE is an executive-level leadership role responsible for standing up and running the HPS POC and NPI lines in Richardson, Texas, where new technology, materials and processes are proven before they reach a volume site. In this role, you will build and lead the Richardson Technology CoE and bring POC/NPI lines live in Q2 2027. You will turn customer and HPS architectures into proven processes through pathfinding and co-development, own early build validation on CRT3, and co-validate the technology roadmap well ahead of EVT. HPS NPD integrates the functions into one streamlined technical development process; it does not replace them. The Director therefore works hand in hand with HPS design, the Technology Roadmap & Suppliers team, the MTL and TRL readiness leads, test development, supply chain and the volume sites, so that every transfer arrives with proven process windows and the data behind them.
Detailed Description1. People Management & CoE Leadership Lead and scale the 33-role CRT3 Technology Center of Excellence (CoE), embedding an engineering culture of technical rigor, data-driven decisions, and cross-functional collaboration. Build deep on-site expertise in process engineering, tooling, test protocols, and failure analysis to de-risk first-of-a-kind (FOAK) materials, equipment, and assemblies. Manage line allocation and engineering bandwidth across pathfinding sprints, technology qualifications, and NPI builds in alignment with NPD governance priorities.
2. CRT3 Proving Lines Stand-Up & Operations Drive commissioning and qualification of four Richardson lines: the two POC lines in Q1 2027 and two NPI lines in Q2 2027, partnering with facilities, CAPEX owners, EHS, IT, and equipment vendors. Own capability across SMT front end (SPI, placement, reflow, AOI, AXI, BGA rework), back end and assembly (selective wave, press-fit, TIM dispense, smart torque), test suites (flying probe, boundary scan, burn-in, two-phase liquid cooling), the FA lab, and an ISO 6 cleanroom for optics. Automate operations end to end using MES, SPC, and station-level traceability.
3. Pathfinding, Co-Development & Technology Qualification Direct three CRT3 engagement models: rapid pathfinding sprints to explore novel architectures, technology qualifications for new components, and complete NPI launches that prove products before volume handoff. Guide programs through concept intake, DOE execution, rapid prototyping, and process capability optimization (Cpk). Lead Pre-EVT manufacturability pathfinding on decoupled builds to freeze designs early, partnering with HPS design teams and customer architects to validate concepts on real hardware.
4. Technology Roadmap Co-Validation Co-validate breakthrough roadmap technologies well ahead of EVT, including NPO ICA, co-packaged copper (CPC), CPO, 224G links, flyover cables, advanced cold plates, liquid cooling, liquid-metal TIMs, and large BGA substrates. Partner with the Director of Technology Roadmap & Suppliers to ensure proving lines address ecosystem needs and host supplier and tooling qualification trials.
5. Early Build Validation, Transfer & Governance Own early build validation on CRT3 lines, generating proven transfer packages containing validated recipes, process windows, and build telemetry for volume production sites. Drive NPD governance via gate reviews and NUDD risk registers to secure EVT/DVT first-pass success
Knowledge/Skills/Competencies- Line Start-Up & Operations: Proven track record of specifying, installing, qualifying and running SMT, back-end and test lines or a technology development lab, including equipment selection, CAPEX planning and line qualification.
- Technical Depth: Deep knowledge of SMT and advanced packaging processes, large BGA and thick-board assembly, thermal solutions (cold plates, liquid and two-phase cooling, TIMs), optics and high-speed interconnect, and new materials and solder pastes. Strong command of DOE, process windows, Cpk, PFMEA and reliability methods.
- Data & Digital Manufacturing: Experience with MES, SPC and traceability systems, and with using build data to drive yield learning and transfer decisions.
- Cross-Functional Influence: Exceptional ability to operate in a highly matrixed environment, integrating design, manufacturing, test, supply chain and site teams around shared goals rather than working in a siloed or purely gatekeeping capacity.
- Executive and Customer Presence: Proven ability to present technology results, line plans and trade-offs clearly to executives and to customer engineering teams.
Physical DemandsTypical ExperienceExperience: : 12+ years in advanced electronics manufacturing, process development or NPI within high-performance compute, networking, hyperscaler, advanced semiconductor packaging or tier-1 EMS environments, with at least 5 years leading engineering teams.Typical EducationB.S. or M.S. in Mechanical, Electrical, Industrial, or Systems Engineering (Advanced degree preferred).
NotesThis job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
