Advanced Micro Devices, Inc

Data Center System Interconnect Engineer

Advanced Micro Devices, Inc$110K — $130K *
Information Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 5-7 years of hands-on experience in high-speed interconnect engineering
  • Proficient in developing and qualifying connectors and cables specifically for data center systems
  • Strong knowledge of signal integrity and mechanical reliability testing
  • Demonstrated ability to manage supplier relationships and development programs
  • Familiarity with engineering tools such as CAD and simulation software is preferred
  • Master's degree in Mechanical, Electrical, Materials, or Systems Engineering; Ph.D. is preferred

Responsibilities

  • Lead the design of high-speed interconnect components for data centers
  • Architect innovative solutions for advanced packaging and multi-node systems
  • Conduct performance validation through rigorous testing and analysis
  • Develop testing boards and methodologies for manufacturing readiness
  • Oversee supplier programs to ensure a robust supply chain for connectivity solutions
  • Work cross-functionally to enhance interconnect performance across all domains
  • Create and maintain detailed engineering documentation for production

Benefits

  • Comprehensive health insurance
  • Retirement savings plans with company matching
  • Employee discounts and wellness programs
  • Flexible work arrangements
  • Professional development and training opportunities
Full Job Description
THE ROLE:

AMD is driving innovation in data center infrastructure, enabling next-generation AI, cloud, and high-performance computing platforms through advanced interconnect solutions. As a Data Center System Interconnect Engineer, you will lead the design and development of high-speed connectors, cables, and sockets that form the backbone of modern server and rack-scale architectures. This role blends deep technical expertise with system-level thinking to deliver scalable, reliable, and cost-optimized interconnect solutions that power AMD's leadership in hyperscale and enterprise environments.

THE PERSON:

The ideal candidate is a hands-on, system-level interconnect engineering leader with experience developing and qualifying high-speed connectors, cables, sockets, and blind-mate interfaces for data center or other complex hardware platforms. They combine expertise in signal integrity, mechanical reliability, tolerance analysis, materials, and failure analysis with strong supplier leadership and cross-functional communication skills. They are collaborative, decisive, and energized by solving complex interconnect challenges that improve the performance, scalability, reliability, and manufacturability of AMD's next-generation AI and high-performance computing systems.

KEY RESPONSIBLITIES:
  • Own end-to-end development of high-speed interconnect components-connectors, cables, and sockets-optimized for data center platforms and rack-scale deployments.
  • Architect advanced interconnect solutions for emerging packaging technologies, multi-node systems, and high-density racks, influencing platform-level design decisions.
  • Lead performance validation through signal integrity analysis, mechanical reliability testing, and compliance with industry standards for high-speed data transmission.
  • Develop and qualify interconnect ecosystems including test boards, fixtures, and evaluation methodologies to ensure readiness for high-volume manufacturing.
  • Manage multi-supplier programs to accelerate innovation and maintain a robust supply chain for critical interconnect technologies.
  • Collaborate cross-functionally with packaging, board, and system teams to optimize interconnect performance across electrical, mechanical, and thermal domains.
  • Create and maintain technical documentation including specifications, BOMs, and assembly guidelines for manufacturing and quality assurance.
  • Drive continuous improvement by mentoring teams, fostering innovation, and advancing AMD's interconnect technology roadmap.

PREFERRED SKILLS:
  • Proven experience in high-speed interconnect technologies for data center systems, including blind mate connectors, cables, and sockets.
  • Knowledgeable in optical connectors for datacenters.
  • Expertise in mechanical tolerance analysis (RSS/Monte Carlo) and connector reliability standards.
  • Hands-on experience with signal integrity principles, VNA measurements, and failure analysis of separable interfaces and solder joints.
  • Familiarity with contact metallurgy, plating finishes, and root cause analysis for interconnect failures.
  • Strong program leadership skills with experience managing supplier development and qualification.
  • Proficiency in CAD tools (AutoCAD, SolidWorks), simulation tools (LabVIEW, MATLAB, JMP), and structural FEA is a plus.
  • Excellent communication skills for technical documentation and executive presentations.


ACADEMIC CREDENTIALS:
  • MS in Mechanical, Electrical, Materials, or Systems Engineering (Ph.D. preferred).

LOCATION:

Austin, TX

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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