Advanced Micro Devices, Inc

Advanced Package Thermal Technologist

Advanced Micro Devices, Inc • $120K — $145K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5-7 years of experience in thermal modeling and architecture roles
  • MS or PhD in Engineering or Physics required
  • Expertise in multi-physics modeling including thermal, thermo-mechanical, and electro-optical disciplines
  • Proven ability to influence product roadmaps and collaborate across diverse technical teams
  • Experience with advanced PCB technologies and assembly processes
  • Familiarity with AI/ML applications in engineering workflows
  • Strong track record of validating simulation models with experimental data

Responsibilities

  • Drive model-based architecture and design decisions for advanced packaging technologies
  • Develop and maintain thermal and multi-physics models and validation strategies
  • Engage with suppliers and partners to align materials and processes with architectural needs
  • Define strategic direction for thermal and package technology development
  • Serve as a thermal subject-matter expert for data center platforms

Benefits

  • Comprehensive health, dental, and vision insurance
  • 401(k) retirement plan with company match
  • Flexible work hours and remote work options
  • Generous paid time off policy
  • Continuous learning and development opportunities
Full Job Description
Advanced Package Thermal Technologist

THE ROLE:

In this role, you will serve as a Package-centric Thermal Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply thermal models to guide SoC/package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

THE PERSON:

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for package-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

KEY RESPONSIBILITIES:
  • Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
  • Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
  • Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
  • Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.

PREFERRED EXPERIENCE:
  • Demonstrated experience owning and driving model-based architecture & design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
  • Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design & assembly trade-offs.
  • Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
  • Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
  • Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
  • Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
  • Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
  • Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.

ACADEMIC CREDENTIALS:

MS or PhD in relevant Engineering disciplines or physics.

LOCATION:

Austin, Texas

This role is not eligible for visa sponsorship

Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

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Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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