Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field.
Extensive experience in high-speed PCB fabrication, signal integrity, and advanced interconnect development.
Strong background in backplane architecture and copper transmission systems.
Knowledge of substrate and package fabrication is a plus.
Demonstrated expertise in PCB technology impacting electrical performance.
Ability to evaluate emerging technologies and develop technical strategies.
Excellent analytical, problem-solving, and collaboration skills.
Responsibilities
Work closely with external PCB suppliers to influence industry direction.
Provide technical guidance and mentorship across engineering teams.
Support customer engagements by translating technical concepts into design recommendations.
Lead R&D efforts focused on copper in backplane connector systems.
Serve as the technical expert on PCB design and electrical performance.
Investigate and evaluate new architectures and technology concepts.
Collaborate cross-functionally with various engineering teams.
Lead modeling, prototyping, and validation of advanced PCB stack-up solutions.
Benefits
Opportunity to shape the future of high-speed backplane connectivity.
Work on cutting-edge technology pushing the limits of copper performance.
Full Job Description
Title: Advanced Materials and Technology Engineer - PCB Technology Focus
Location: Nashua, NH
Amphenol's High-Speed Backplane Connector business unit is seeking a highly specialized technical expert to help define and develop the future of copper-based backplane interconnect technology. This role is focused on enabling the next generation of high-speed signal transmission in backplane architectures, with a long-term goal of achieving 448G and beyond performance using copper backplane connectors.
The ideal candidate will be a hands-on technical leader with deep expertise in PCB fabrication technology and PCB materials, substrate and package fabrication, signal integrity and high-speed interconnect design. This individual will serve as a key subject matter expert on the PCB and its interaction with connector and system-level architecture, helping bridge the gap between emerging technology concepts and practical product development.
Responsibilities:
Work closely with external PCB suppliers to influence industry direction and future product requirements.
Provide technical guidance and mentorship across engineering teams on PCB and backplane-related topics.
Support customer engagements by translating advanced technical concepts/needs into practical design recommendations.
Lead research and development efforts focused on the future of copper in backplane connector systems.
Serve as the technical expert on PCB design, material selection, stack-up optimization, and electrical performance as it relates to connector integration.
Investigate, define, and evaluate new architectures and technology concepts that may not yet exist in the market.
Collaborate cross-functionally with product development, systems engineering, signal integrity, materials, manufacturing, and customer-facing technical teams.
Lead the modeling, prototyping and validation advanced PCB stack up solutions for high-speed applications with our external partners.
Identify technical barriers and create development roadmaps to overcome limitations in copper-based transmission.
Qualifications:
Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a closely related technical field.
Extensive experience in high-speed PCB fabrication, signal integrity, and/or advanced interconnect development.
Strong background in backplane architecture and copper transmission systems.
Substrate and package fabrication knowledge is a plus.
Demonstrated expertise in PCB technology and how it impacts end-to-end electrical performance.
Ability to evaluate emerging technologies and develop forward-looking technical strategies.
Excellent analytical, problem-solving, and cross-functional collaboration skills.
Experience with 56G, 112G, 224G, 448G, or similarly advanced high-speed signaling environments is a plus.
Background in connector development, high-speed channel design, or advanced package/board-level integration is a plus.
Ideal Candidate Profile
Recognized technical expert in PCB and high-speed signal transmission.
Comfortable working on problems where the solution does not yet fully exist.
Passionate about enabling the future of copper interconnect performance.
Able to think strategically while remaining deeply engaged in technical detail.
Thrives in a collaborative environment that values innovation, rigor, and execution.
Why Join Us
This is a unique opportunity to shape the future of high-speed backplane connectivity at Amphenol. You will work on cutting-edge technology that pushes the limits of what copper can achieve and help define the roadmap for next-generation systems.
