Advanced Micro Devices, Inc

Technical Fellow - High-Speed Interconnect & Optics

Advanced Micro Devices, Inc • $180K — $220K *
Santa Clara, CA 95051In-Person
Telecommunications & Hardware
Less than 5 years of experience
Reposted Today
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Job Overview by Ladders

Qualifications

  • PhD or Master's degree in Computer Science, Electrical Engineering, Photonics, or related field.
  • 5-7 years of experience in high-speed signal integrity and power integrity design at advanced data rates.
  • Expertise in optical interconnect technologies including pluggable optics, co-packaged optics, and onboard optics.
  • Proven skills in optical packaging and system integration.
  • Hands-on experience with system bring-up and validation.
  • Strong understanding of SerDes architecture and system-level modeling.
  • Demonstrated leadership in influencing across organizational boundaries.

Responsibilities

  • Drive excellence in high-speed signal integrity (SI) and power delivery network (PDN) design for ASICs and optical interfaces.
  • Lead integration of optical systems, including module architecture and thermal optimization.
  • Guide the co-optimization of SerDes architecture with ASIC and packaging requirements.
  • Provide hands-on technical leadership during lab bring-up and debugging phases.
  • Represent AMD in technical industry bodies to influence specifications and align ecosystems.
  • Mentor senior engineers to establish best practices and elevate technical excellence.
  • Advise senior leadership on critical technical trade-offs affecting product strategy.

Benefits

  • Comprehensive health and wellness benefits.
  • Retirement planning options and financial savings programs.
  • Opportunities for professional development and continuing education.
  • Flexible work arrangements promoting work-life balance.
Full Job Description
THE ROLE:

The Technical Fellow for High-Speed Interconnect and Optics is a senior technical leader responsible for defining and advancing NTSG's system-level interconnect architecture for next-generation AI, HPC, and data center platforms. This role drives innovation across electrical and optical interconnect technologies-spanning ASICs, advanced packaging, boards, optics, and full-system integration-while shaping industry direction and contributing to AMD's long-term technology roadmap

THE PERSON:

Defining next-generation interconnect architecture in thisLead role and long-term strategy for next-generation electrical and optical interconnects, including pluggable optics, co-packaged optics (CPO), co-packaged copper (CPC), and onboard optics (OBO), enabling scalable AI scale-up and scale-out system architectures.

KEY RESPONSIBILITIES:

Drive System-Level SI/PI Excellence
  • Provide technical authority and leadership in high-speed signal integrity (SI) and power delivery network (PDN) design across ASICs, packages, boards, connectors, and optical interfaces. Ensure robust, end-to-end performance at 112G, 224G, and beyond under real-world system operating conditions.

Lead Optical System Integration and Packaging Innovation
  • Drive end-to-end optical system integration, including optics module architecture, silicon photonics, laser integration (internal and external), advanced packaging solutions, and thermal and power optimization for high-density systems.

Guide SerDes and ASIC Co-Optimization
  • Influence SerDes architecture, specifications, modeling assumptions, and tuning strategies to ensure alignment between ASIC design and real-world channel behavior, optical characteristics, packaging constraints, and system-level requirements.

Hands-On Technical Leadership and Debug
  • Serve as a hands-on technical authority during lab bring-up, characterization, and system debug. Resolve complex, cross-layer issues spanning SI/PI, optics, firmware, packaging, and system-level interactions across development and deployment phases.

Shape Industry Direction and Ecosystem Alignment
  • Represent AMD as a technical leader in industry standards bodies and consortia (e.g., OIF, IEEE, PCI-SIG). Influence next-generation specifications, drive ecosystem alignment, and ensure AMD's interconnect roadmap leads and aligns with industry trends.

Mentor and Multiply Technical Impact
  • Mentor senior engineers, architects, and emerging technical leaders. Establish best practices, architectural frameworks, and design guidelines to elevate technical excellence across teams and business units.

Influence Business and Product Strategy
  • Act as a trusted technical advisor to senior leadership. Drive critical technical trade-offs, vendor and partner strategy, and product go/no-go decisions that materially impact product direction, risk, cost, and time-to-market.


PREFERRED QUALIFICATIONS:
  • Deep expertise in high-speed signal integrity and power integrity (SI/PI, PDN) for advanced data rates (112G, 224G, and beyond).
  • Strong experience across optical interconnect technologies, including:
    • Pluggable optics (QSFP, OSFP)
    • Co-Packaged Optics (CPO)
    • Co-Packaged Copper (CPC)
    • On-Board Optics (OBO)
  • Proven experience in optical packaging and system integration, including silicon photonics, laser coupling strategies, and thermal and power management at scale.
  • Hands-on experience with system bring-up, validation, and debug across ASICs, packages, boards, and optical subsystems.
  • Strong understanding of SerDes architecture, equalization, FEC, and system-level channel modeling.
  • Demonstrated ability to lead across organizational boundaries and influence vendors, partners, customers, and standards bodies.
  • Track record of sustained technical leadership and architectural impact across multiple product generations.
  • Recognized industry or academic thought leader;publications and patents astrong plus

ACADEMIC CREDENTIALS:

Master's in Computer Science, Electrical Engineering, Photonics, or a related technical field, PhD preferred

Location:

Santa Clara, CA

This role is not eligible for visa sponsorship.

#LI-RF1

Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

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Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

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AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Manufacturing & Automotive
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ
AMD
* Ladders Estimates

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