THE OPPORTUNITY:At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging Integration, you'll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance.
This is a rare opportunity to shape the technical direction of two of TechInsights' most dynamic product areas: Advanced Packaging and High Performance Computing. You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.
Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.
WHAT YOU'LL DO Lead with Technical Authority- Serve as TechInsights' subject matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration..
- Provide authoritative insights on leading-edge and emerging packaging and system integration technologies, including:
- 2.5D/3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.
- Co-packaged optics, chip-to-chip optical engines, and photonic-electronic IC integration (PIC + EIC).
- Hybrid bonded chiplet stacks, SRAM chiplets, and next-generation thermal and power delivery innovations.
Own and Evolve Technology Roadmaps- Shape and maintain TechInsights' Advanced Packaging and HPC technology roadmaps, aligning analysis coverage with industry trends and customer value.
- Identify and prioritize parts and systems for analysis across processors, accelerators, and networking platforms to capture market-defining innovations.
- Help drive product evolution toward system-level analysis, including server performance testing, interconnect and power delivery characterization, and thermal benchmarking.
Accelerate Content Creation through AI and Innovation- Leverage AI-enabled tools and data workflows to increase the speed, accuracy, and scalability of analysis.
- Create and apply new techniques that connect process flow, packaging design, and system performance metrics.
- Assertively drive content velocity and analytical quality across teams.
Engage Globally and Lead by Influence- Represent TechInsights worldwide to present at conferences, lead customer technical discussions, and publish thought leadership that positions TechInsights at the forefront of semiconductor intelligence.
- Mentor analysts, shape analytical methods, and foster cross-domain collaboration between packaging, logic, memory, and system analysis teams.
- Travel internationally to meet with hyperscalers, foundries, fabless companies, and system manufacturers.
WHAT YOU'LL BRING - A recognized expert in semiconductor packaging, interconnect, or processor design, with 10+ years of relevant industry experience.
- Master's or PhD in Nanotechnology, Electrical Engineering, Materials Science, Applied Physics, or equivalent field experience.
- Adept at connecting materials, process, and architecture to system-level performance in HPC or networking applications.
- Deeply familiar with one or more of the following domains:
- Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).
- Processor and chiplet architecture (CPU, GPU, DPU, TPU, FPGA, ASIC).
- System-level power, thermal, and performance analysis.
- Demonstrated success applying AI and automation tools to accelerate technical content or workflow efficiency.
- An effective communicator and storyteller comfortable engaging with engineers, executives, and customers alike.
- Motivated by curiosity, collaboration, and a desire to define what comes next in semiconductor analysis.
- Willing to travel globally (up to 25%) to build relationships and represent TechInsights at technical and industry events.
As part of the recruitment process for this position, you will be required to submit your latest citizenship and/or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations.
WORKING ARRANGEMENTThis role is on-site at our Ottawa office. Travel may be required up to 25% of the time.
