Description
Systems engineer to own the electrical interconnect architecture and subsystem communications for a complex, high performance optical system. Contribute in all phases of the product development cycle, from customer and system requirements through specification, design, prototyping, verification, validation, manufacturing, install, and field support. Requires in-depth technical knowledge of electrical and electro-mechanical systems (cabling, power and signal distribution, motion, imaging, and control networks) in a volume manufacturing environment within a data-driven culture. Self-motivated to lead multi-disciplinary team projects to successfully demonstrated results.
Key Responsibilities
• Define the system-level electrical interconnect architecture: harness and cable topology, connector and pin-out standards, power distribution, grounding and shielding, and routing constraints for optical, motion, and substrate-handling subsystems.
• Derive electrical and communication requirements from customer and system requirements; document them in interface control documents (ICDs) and provide input to electrical, software, and mechanical design engineers throughout the design process.
• Define and own subsystem communication architecture and protocols (for example Ethernet/GigE, EtherCAT, CAN, serial, USB, and camera/frame-grabber links), including timing, synchronization, bandwidth, and latency budgets between controllers, motion axes, cameras, illumination, and sensors.
• Use project management skills to lead interconnect and communications subsystem projects. Plan, schedule, monitor, and execute by leading cross-functional teams to meet success criteria.
• Develop and maintain error and noise budgets (EMI/EMC, signal integrity, power integrity, timing) and define subsystem-level requirements to be characterized and validated during system alpha testing for current and future products.
• Collaborate and communicate with suppliers during design, qualification, and manufacturing of critical cable assemblies, connectors, and communication hardware.
• Define and execute system test plans for prototype acceptance and qualification of cables, harnesses, power and communication subsystems.
• Design and execute experiments (DOE) to validate error budgets, assess and mitigate system performance and reliability risks (intermittent connections, noise coupling, bus errors, thermal and flex-life limits).
• Troubleshoot and root cause complex system-level electrical, communication, and HW/SW integration issues in manufacturing and the field using oscilloscopes, protocol analyzers, and system logs.
• Implement new or improved system diagnostics, self-tests, and calibrations for communication links and interconnect health; validate through testing.
• Support system manufacturing activities and customer site teams to resolve critical issues during install, qualification, and production use; support failure analysis of field-return modules.
• Drive design-for-manufacturing and design-for-service of interconnects: documentation (procedures, work instructions, BKMs), training, and change control.
• Mentor junior engineers; write and present technical reports summarizing findings and recommending solutions.
Education
• BS, MS, or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.
• 7+ years of relevant experience with a BS, 5+ years with an MS, or 2+ years with a PhD.
Qualifications
• Hands-on experience designing, building, and debugging electrical interconnects and electro-mechanical systems (cable/harness design, connectors, power distribution, grounding, and shielding).
• Working knowledge of industrial and embedded communication interfaces and protocols (Ethernet, EtherCAT, CAN, RS-232/485, USB, camera interfaces) and of timing and trigger signal distribution.
• Experience reading and creating electrical schematics, wiring diagrams, and interface control documents.
• Experience with test and measurement equipment (oscilloscopes, logic and protocol analyzers, DMMs, network analyzers).
• Experience designing and executing test plans and concept and feasibility studies.
• Strong troubleshooting skills, including system and subsystem level SW debugging based on error messages and SW logs.
• Proficient with data analysis and visualization; strong scripting experience such as Python or Matlab.
• Demonstrated ability to collaborate across disciplines, manage multiple projects simultaneously, and drive parallel progress.
Preferred Qualifications
• Experience with EMI/EMC and signal integrity analysis, mitigation, and compliance testing (SEMI S2, CE).
• Experience with semiconductor equipment, precision motion systems, or imaging platforms; familiarity with SECS/GEM and fab integration.
• Experience with EDA or harness design tools (for example EPLAN, SolidWorks Electrical, or Zuken).
• Familiarity with high-speed imaging data paths (high-speed cameras, frame grabbers, CoaxPress/Camera Link).
• SW automation experience and AI tools experience (Claude Code and others) a plus.
• Demonstrated ability to drive technical projects with a multi-disciplinary team to completion.
• Experience supporting manufacturing and service organizations through training, documentation (procedures, OMS, BKMs, etc.), and troubleshooting.
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 20% of the Time
Relocation Eligible:
No
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
