FormFactor

Sr Principal Signal Integrity Engineer

FormFactor$115K — $151K *
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • BS/MS in Electrical Engineering (or related field)
  • 8+ years of relevant experience in SI/PI analysis and design
  • Strong understanding of transmission line theory and power integrity principles
  • Experience with HFSS, ADS, SIwave, and other simulation tools
  • Hands-on experience with VNA, TDR/TDT measurement tools
  • Familiarity with high-speed interfaces like PCIe and HBM
  • Proficient in scripting/programming languages such as Python and MATLAB

Responsibilities

  • Perform signal and power integrity analysis for high-speed interconnects
  • Develop and validate electrical models for transmission lines and PDN structures
  • Define stack-ups, impedance targets, and routing constraints
  • Evaluate and optimize performance metrics like crosstalk and jitter
  • Use EM and circuit tools for frequency and time-domain analysis
  • Conduct what-if studies to enhance performance and mitigate risks
  • Drive simulation-to-measurement correlation and implement design improvements

Benefits

  • Medical, dental, and vision insurance
  • Life insurance and disability coverage
  • 401(k) plan with company match
  • Employee stock purchase plan (ESPP)
  • Quarterly profit-sharing bonuses
  • Paid time off and flexible spending or savings accounts
Full Job Description
Shift:
The regular hours for this position are day shift.

Job Description:

In the role of SrPrincipal Signal Integrity Engineer, you will be responsible for completing tasks on time and solving short- and long-term problems. You will be part of a technical group, responsible for improving SI/PI performance, completing production design analysis, and measurement and characterizing. This role will be working with customers and engineers across multiple sites, California US, Europe and Asia Regions.

Key Responsibilities:

Design & Analysis
  • Perform signal and power integrity analysis for high-speed interconnects (PCB, package, MLO, probe card).
  • Develop and validate electrical models for Transmission lines, vias, connectors, and PDN (Power Distribution Network) structure.
  • Define stack-ups, impedance targets, and routing constraints.
  • Evaluate and optimize Reflections, insertion/return loss, and Crosstalk and jitter performance.


Simulation & Modeling
  • Use EM and circuit tools (e.g., HFSS, ADS, SIwave, PowerSI) for Frequency-domain and time-domain analysis.
  • Build system/channel models (e.g., IBIS-AMI, eye diagrams).
  • Run what-if studies to optimize performance and reduce design risk.


Testing & Validation
  • Define and execute SI validation plans using VNA, TDR, TDT and high-speed measurement setups.
  • Define test fixtures and correlation structures.
  • Drive simulation-to-measurement correlation and root cause analysis.
  • Drive design improvements based on measured data.


Design Support & Collaboration
  • Provide design guidelines, constraints, and best practices to layout teams and electrical design engineers.
  • Collaborate globally with engineering teams and customers.
  • Support new product development programs (e.g., probe cards, load boards).


Continuous Improvement & Innovation
  • Improve modeling methodologies and design workflows.
  • Reduce simulation cycle time and improve design quality.
  • Stay current with High-speed interfaces (PCIe, HBM, SerDes), and Emerging packaging and interconnect technologies.
  • Contribute to next-generation architecture and roadmap development.


Preferred Qualifications:
  • BS/MS in Electrical Engineering (or related field).
  • 8+ years of relevant experience in SI/PI analysis and design.
  • Strong understanding of: Transmission line theory, Power integrity principles, Crosstalk and signal degradation mechanis.
  • Experience with tools such as: HFSS, ADS, SIwave, PowerSI, PowerDC, SPICE, Allegro, MATLAB.
  • Hands-on experience with measurement tools (VNA, TDR/TDT).
  • Experience with high-speed interfaces (PAM4, SerDes, PCIe, HBM).
  • Scripting/automation (Python, MATLAB).
  • Experience in advanced packaging, probe cards, or fine-pitch interconnects.


Skills:
Allegro PCB Designer, ANSYS HFSS, Cadence Tools, High Speed Interfaces, MATLAB, Power Distribution Design, Power Integrity, PSpice Circuit Simulation, Python (Programming Language), SERDES, Signal Integrity, Signal Integrity Analysis, Transmission Line Design

Education & Experience:
Minimum of 8 years of related experience with a Bachelor's degree; or 6 years and a Master's degree; or a PhD with 3 years experience; or equivalent experience | Required

Pay Range:
$115,800.00 - $151,935.00

Pay Range Explained:
This role in Beaverton, Oregon pays between $115,800.00 and $151,935.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You'll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.

About FormFactor

FormFactor, Inc. is a leading provider of essential test and measurement technologies along the full IC life cycle ? from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor?s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America. FormFactor is headquartered in Livermore, California with operations worldwide.
Learn more about FormFactor
Size
2,293 employees
Market Cap
$1.7 billion
Industry
Net Income
$78.5 million
Founded
1995
5 Year Trend
+14.9%
Revenue
$693.6 million
NASDAQ

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