General Summary:As a Senior Hardware Design Engineer, you will join an inventive team responsible for developing next-generation 6G prototype platforms and high-performance hardware modules. This role sits at the intersection of circuit design and physical validation, taking high-speed digital designs from initial schematic architecture through physical PCB layout oversight and lab testing. You will collaborate closely with global, cross-functional teams (including PCB CAD, Signal Integrity, Firmware, Mechanical, and Thermal) to deliver high-quality hardware solutions.
Minimum Qualifications:• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Key Responsibilities- Drive schematic capture, select hardware components, and manage complex bills of materials (BOMs) for multi-layer digital designs.
- Oversee and actively participate in the physical PCB layout process, ensuring strict compliance with high-speed digital routing rules and constraints.
- Perform physical board bring-up, debugging, and functional characterization of prototype hardware in the lab.
- Utilize lab test equipment (e.g., high-bandwidth digital oscilloscopes, logic analyzers, and multimeters) to isolate and troubleshoot hardware issues.
- Collaborate with internal Signal Integrity and Power Integrity teams to optimize layout topologies for high-speed buses.
- Document detailed test plans, validation reports, and hardware engineering change orders (ECOs).
Preferred Qualifications- 3-4 years of professional hardware engineering or related product-development work experience.
- Fundamental knowledge of high-speed digital board design principles, including impedance control, crosstalk, and power delivery.
- Ability to design high-speed, high power multi-layer PCBso
- Experience utilizing schematic capture tools and basic simulation software (e.g., Hyperlynx, LTspice).
- Hands-on familiarity with professional PCB layout software suites, such as Siemens/Mentor Xpedition or Cadence Allegro.
- Experience with high-speed interfaces such as Ethernet, PCIe, DDR, USB, or I2C/SPI protocols.
Pay range and Other Compensation & Benefits: $117,800.00 - $176,600.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
