AWS-Annapurna team develops the silicon used in our most advanced machine learning accelerator servers at cutting edge process nodes. These SoCs are used in massively scaled server clusters to provide best hardware platform for our customers to run training and inference workloads.
Our final product is a server, not just the silicon, so you will find yourself stretching beyond traditional silicon product engineering boundaries and dealing with various system issues and data sets, providing ample opportunities to learn.
We are looking for a Senior Technical Program Manager to own end-to-end execution for complex silicon products from development through qualification, production ramp, and high-volume manufacturing.
You will own the integrated product schedule across Product Engineering, Test Engineering, Design, DFT, System Validation, Packaging, Quality, Reliability, Supply Chain, Foundry, OSAT, and external silicon partners.
This role requires you to be the owner of the outcome, not the status update -
You will identify the critical path, expose technical and execution risks early, establish clear owners and dates, drive decisions, and hold teams accountable for closure. You will dive deep enough into technical issues to identify owners, distinguish real blockers from noise and escalate when a decision is required.
Success means products hit committed milestones with the required quality, capacity, and manufacturing readiness
Key job responsibilities
Own the end-to-end silicon product schedule from tapeout and first silicon through bring-up, characterization, qualification, production release, ramp, and HVM.
Build and maintain integrated execution plans across silicon, package, test, quality, reliability, manufacturing, and supply-chain dependencies.
Define milestones, entry and exit criteria, owners, critical paths, and recovery plans.
Drive Product Engineering, Test Engineering, Design, DFT, Packaging, System Validation, Quality, Reliability, and Supply Chain teams to committed deliverables.
Dive deep on execution blockers; identify owner, root cause, decision required, and recovery path.
Drive closure of risks affecting schedule, quality, yield, test coverage, qualification, cost, capacity, or production readiness.
Own execution/communication of schedules and needs across foundry, OSAT and other external manufacturing partners.
Identify long-lead dependencies early, including wafer starts, masks, test hardware, package material, sockets, load boards, qualification hardware, equipment capacity, and translate product demand into manufacturing-capacity requirements and ensure capacity is available when the product needs it.
Drive readiness reviews for first silicon, characterization, qualification, production release, and volume ramp.
Establish mechanisms that expose schedule health, risks, decisions, and dependencies without relying on manual status collection.
Escalate early when teams cannot meet commitments. Bring options, trade-offs, and a recommended path.
Drive decisions when engineering quality, schedule, cost, capacity, and product requirements conflict.
Communicate program health to senior leadership with clear facts: what changed, why it matters, what decision is required, who owns the action, and when it will close.
Identify recurring execution failures and drive mechanism changes so the same problem does not reoccur on the next product.
Scale common planning, readiness, and execution mechanisms across multiple silicon programs.
BASIC QUALIFICATIONS
- Bachelor's degree in engineering, management, or technology
- 5+ years of experience in semiconductor product engineering, test engineering, silicon operations, manufacturing, or technical program management.
- Demonstrated ownership of semiconductor programs through major milestones such as tapeout, first silicon, bring-up, characterization, qualification, production release, ramp, or HVM.
- Working knowledge of semiconductor product-development and manufacturing flows across wafer fabrication, wafer sort, package assembly, final test, SLT, characterization, qualification, reliability, yield, and failure analysis.
- Experience driving execution across engineering teams that do not report to you.
PREFERRED QUALIFICATIONS
- Experience with CPU, GPU, AI/ML accelerator, networking, or other large advanced-node SoCs.
- Experience driving products into high-volume manufacturing.
- Experience with advanced packaging, chiplets, 2.5D/3D integration, or HBM.
- Experience with ATE, SLT, product characterization, manufacturing test, yield ramp, and product qualification.
- Direct experience with leading foundry and OSAT partners.
- Experience managing capacity across wafer, package, assembly, and test.
- Experience owning multiple products or silicon generations concurrently.
- Experience creating execution mechanisms for a silicon organization that is scaling rapidly.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, TX, Austin - 148,700.00 - 201,200.00 USD annually
