Full Job Description
Senior Principal Packaging Engineer
Responsibilities:
• Develop FCMCM package - Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost
• Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
• Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.
• Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
• Design new customized tooling to adopt off the shelf equipment for our high-volume production.
• Perform verification and qualification activities for new tooling, machine and materials in development projects
• Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.
• Creation, regular review and updating of design & equipment process FMEA
• Technical support on Manufacturing with troubleshooting and providing technical solution
• Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
• Coordinate and support initial mechanical reliability test with failure analysis for root cause finding
Requirements:
• B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.
• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, SiP/modules, and power packages.
• Knowledge on die attach equipment of Datacon Evo is preferred.
• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.
• Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.
• Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
RSU Eligible
This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject to individual and company performance.
Salary Range
The Salary Range for this position is $161,000 - $228,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.
Benefits: This position offers a comprehensive benefits package including but not limited to:
• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.
