Bachelor’s degree in engineering, physics, or a related field.
5 years of experience in high-speed package and/or advanced PCB layout.
Strong knowledge of high-speed layout and electronic design principles.
Proficient in EDA layout tools, particularly Cadence APD and Allegro.
Familiarity with PCB layout and mechanical, thermal, and optical design aspects.
Understanding of RF, analog, and digital circuit design.
Ability to collaborate with cross-functional teams and suppliers.
Responsibilities
Conduct package design feasibility assessments with manufacturing and engineering teams.
Create multi-layer substrate and carrier layouts for various IC configurations.
Design wafer-level interconnect layouts using advanced technologies.
Collaborate with signal integrity experts to innovate high-speed designs.
Manage multiple projects simultaneously in a fast-paced environment.
Benefits
Opportunity to work on cutting-edge high-speed designs.
Collaborative environment with cross-functional teams.
Access to advanced EDA tools and technologies.
Potential for professional growth and development in a dynamic field.
Full Job Description
Job Summary
We are looking for a motivated Package and PCB Layout Engineer to join our R&D hardware design team. The successful candidate will become a key member of the design engineering community of the Signal Integrity Products business unit, contributing innovative high-speed designs across a variety of interconnect technologies.
Responsibilities
Depending on the candidate’s strengths and interests, responsibilities may include any of the following areas of focus:
Perform package design feasibility assessments for the signal integrity experts, in conjunction with the manufacturing and thermo-mechanical engineering teams.
Develop multi-layer substrate and carrier layouts to support 2D, 2.5D, and 3D IC configurations.
Develop wafer-level interconnect layouts using wafer redistribution layers and wafer reconstruction technologies.
Minimum Qualifications
Bachelor’s degree in engineering, physics, or another discipline relevant to the position.
5 years of layout experience in high-speed package and/or advanced PCB technologies.
Solid knowledge of high-speed layout and electronic design.
Advanced knowledge of EDA layout tools.
Familiarity with PCB layout, as well as mechanical, thermal, and optical design.
Understanding of RF, analog, and digital circuits.
Ability to work in parallel with several cross-functional internal teams, while coordinating with local and international suppliers.
Excellent written and oral communication skills, and the ability to work well with other team members.
Ability to work independently with little supervision in a fast-paced environment.
Desired Qualifications
Advanced knowledge of Cadence APD and Allegro.
Knowledge of AI design acceleration features in EDA layout tools.
Additional degrees or certifications in mechatronics, photonics, or electronics manufacturing.
Familiarity with a variety of interconnect configurations, including chip-on-board, wirebond, flip-chip, optical assembly, and high-speed connectors.
Familiarity with industry standards such as JEDEC and IPC.
Experience troubleshooting PCBs and systems.
High degree of creativity, determination, and innovation.
What Success Looks Like
First 3 months: Become familiar with Semtech’s design flows, EDA tools, and supplier ecosystem, and complete [a first layout or feasibility assessment] under guidance.
First 6 months: Independently own [number/type] package or PCB layouts from feasibility through release to fabrication, meeting schedule and design-rule requirements.
First 12 months: Become a go-to contributor for [2.5D/3D IC, wafer-level, or another technology] and support [number] tape-outs or product releases.
A reasonable estimate of the pay range for this position is $105,000-$122,000 CAD. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.
About Semtech
Semtech Corporation is a leading supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms. The company is dedicated to providing proprietary solutions and breakthrough technology for circuit protection (TVS), high-reliability power management, and advanced communications technologies. Semtech's products are used in some of the most innovative systems and products in the fastest-growing markets in technology today, including the Internet of Things (IoT), data centers, and mobility. Semtech is publicly traded on the NASDAQ under the symbol SMTC.
