Master's Degree or higher in Engineering, Physics, or Material Science.
10+ years of experience in semiconductor companies focusing on PIC packaging design.
5+ years experience with optical fibers and optical measurements.
5+ years with advanced semiconductor packaging OSAT or EOL vendors.
Proficiency in fiber attach tooling and process development.
Expertise in developing reliability and yield metrics for packaging quality.
Responsibilities
Develop high-accuracy optical packaging and fiber-to-chip alignment schemes.
Create packaging prototypes and establish scalable assembly processes.
Review and collaborate on design BOMs for parts procurement.
Conduct experiments to enhance the reliability of optical packages.
Work with manufacturing to transfer successful prototypes to production.
Guide vendors in setting up high-throughput assembly lines.
Source materials from external vendors and adapt to evolving requirements.
Benefits
Full-time roles are eligible for equity participation.
Access to comprehensive employee benefits.
Opportunities to work on cutting-edge quantum computing technology.
Collaborate with industry-leading Fortune 500 companies.
Participate in groundbreaking government-funded projects.
Full Job Description
Job Summary:
The Senior Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits.
Responsibilities:
Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI.Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
Establish and update version-controlled DFM requirements and feed back to packaging design group.
Design, execute, summarize and analyze experiments & process trend studies to improve the performance and reliability of optical packaged assemblies.
Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes.
Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines.
Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
Experience/Qualifications:
Master's Degree or above in Engineering, Physics or Material Science.
10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
5+ years of experience working with optical fibers, optical measurements.
5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment.
Experience with fiber attach tooling & process/flow development and optical data analysis.
Experience with FA and 8D failure resolution techniques.
Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.
We are not accepting unsolicited resumes from employment agencies.
The ranges below reflect the target ranges for a new hire base salary. One is for the Bay Area (within 50 miles of HQ, Palo Alto), the second one (if applicable) is for elsewhere in the US (beyond 50 miles of HQ, Palo Alto). If there is only one range, it is for the specific location of where the position will be located. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.
U.S. Base Pay Range
$160,000-$180,000 USD
Bay Area Pay Range
$183,000-$200,000 USD
About PsiQuantum
PsiQuantum is a California-based company that is developing a quantum computer using photonics technology. The company's goal is to build a fault-tolerant quantum computer with millions of qubits, which would be capable of solving problems that are currently intractable with classical computers. PsiQuantum was founded in 2016 by a team of experts in photonics, quantum computing, and computer science. The company has received funding from investors such as BlackRock, Founders Fund, and Atomico.
