Position OverviewAs a Senior Mechanical Engineer at Positron AI, you will own the mechanical, thermal-mechanical, and enclosure design of our AI inference platforms-from carrier-board mechanical integration and chassis design through rack-level packaging of our Asimov-based systems. You will ensure that the structural, thermal, and manufacturability characteristics of our high-power hardware meet the demands of high-density HPC and data center environments, and you will serve as the primary mechanical interface to our contract manufacturers and custom-part fabricators. This is a high-impact role requiring deep expertise in electromechanical design for high-performance electronic systems and the ability to drive designs from concept through volume production with external partners.
This role is based in-office at our Spokane Valley, WA location. Candidates must be able to work on-site as required.
Key Responsibilities- Mechanical Design Ownership: Own the mechanical design of enclosures, chassis, and carrier-board mechanical integration for rack-mount (1U/2U) inference systems-including spatial studies, conceptual and detailed design, solid models, drawings, BOMs, and tolerance stack-up analysis.
- Thermal & Structural Analysis: Lead thermal-mechanical and structural design and simulation for high-TDP ASIC platforms-heatsinks, cold plates, retention hardware, airflow, and shock/vibration-partnering with electrical and thermal teams to meet air- and liquid-cooled performance targets.
- Manufacturer Engagement: Act as the primary mechanical lead and Positron representative for contract manufacturers, ODMs, and custom-part fabricators (sheet metal, injection molding, die casting, MIM, cable) through EVT, DVT, pilot, and production ramp.
- DFx & Cost Reduction: Lead detailed DFM/DFA reviews-tolerances, assembly sequence, poka-yoke, part reduction and standardization, and DFMEA-to reduce unit cost and improve design robustness.
- Fixtures & Packaging: Develop and qualify custom electromechanical fixtures supporting assembly and test, and own product packaging design, transit qualification, and implementation.
- Validation & Governance: Own mechanical test-plan creation (structural, thermal, environmental), support EMC/EMI shielding and regulatory needs, and manage the mechanical risk register, ECOs, and technical escalations to keep programs on schedule for pilot and manufacturing ramps.
Required Qualifications- Experience: BS/MS in Mechanical Engineering and 7+ years designing electromechanical and enclosure hardware for high-performance electronic systems, spanning the full NPI lifecycle from concept through volume production.
- Mechanical Design & Analysis: Proven expertise in 3D CAD (SolidWorks and/or Creo), detailed drawings and GD&T, tolerance stack-up analysis, and structural/thermal simulation (e.g., SolidWorks Simulation/Flow, Ansys).
- Systems & Manufacturing: Experience with rack-mount or high-density electronic packaging, and direct experience selecting, qualifying, and managing custom-part suppliers and contract manufacturers-including global partners-through EVT/DVT/pilot phases.
- DFx Discipline: Demonstrated track record applying DFM/DFA and FMEA to drive cost, quality, and manufacturability in high-volume or high-complexity production environments.
- Collaboration: Strong ability to write clear mechanical specifications and communicate trade-offs across electrical, thermal, ASIC, firmware, and operations teams.
Preferred Qualifications- AI/ML or HPC Hardware: Background in mechanical and thermal design for AI/ML accelerators, servers, or other high-power data center hardware.
- Advanced Thermal: Experience correlating CFD and thermal-mechanical simulations to real-world air- or liquid-cooled performance (heatsinks, cold plates, manifolds).
- Compliance & Environmental: Experience driving hardware through EMC/EMI shielding, environmental qualification (shock, vibration, thermal), and packaging/transit testing; familiarity with FCC/CE and RoHS/REACH.
- Credentials: Certifications such as Certified SolidWorks Professional, Ansys, DFMA, or packaging qualification (ISTA); relevant patents; and business/finance acumen (e.g., an MBA) connecting design decisions to cost and profitability.
Leveling & ScopeWhile this role is currently posted at a specific level, we are a growth-oriented organization and are open to hiring at a more senior level for the right candidate. Please note that this job description serves as a focused but generalized overview of the role; specific responsibilities and impact expectations will be tailored to the experience and seniority of the final hire.
Compensation & BenefitsThe base salary range for this role is $185,000 - $250,000.
Please note that the figures provided represent the
base salary range only and do not include other elements of our total compensation package, equity, or comprehensive benefits.
At Positron AI, we value the unique expertise each candidate brings. While the range above reflects our typical expectation for the position,
we reserve the flexibility to exceed this range for candidates whose specialized skills, significant experience, or unique qualifications fall outside the standard scope of the role. Final offers are determined based on a variety of factors, including internal equity, and individual impact.
