Senior Manager, Technical Product Support Engineering

Job Summary & Responsibilities

The Senior Manager, Technical Product Support is a global leadership role responsible for defining and executing Onto Innovation’s technical product support strategy for advanced packaging capital equipment supporting Lithography and Panel Inspection Applications. This role ensures high levels of tool availability, customer satisfaction, and rapid learning‑cycle feedback to Onto Innovation’s product development organizations across new product introductions and the installed base.

This position partners closely with R&D, Sustaining Engineering, Product Management, Manufacturing, Global Service, Sales, and key customers to enable successful product ramps, sustain fleet performance, and continuously improve reliability, serviceability, and total cost of ownership. The scope reflects the evolution of Onto Innovation’s portfolio beyond traditional lithography into panel‑level manufacturing and advanced packaging ecosystems.

Key Responsibilities

Technical Product Support Leadership

Lead global Technical Product Support organizations responsible for complex troubleshooting, escalation management, and resolution of tool, process, and system‑level issues.

Serve as the senior escalation authority for critical customer issues, ensuring disciplined root cause analysis (RCA) and corrective/preventive action (CAPA).

Establish standardized technical support processes, knowledge management systems, and documentation to enable consistent global execution and learning transfer.

New Product Introduction (NPI) & Ramp Readiness

Partner with Service NPI, R&D and Product Management to ensure supportability, serviceability, and reliability requirements are embedded throughout product development.

Support Service NPI focused on global technical readiness for FOAK (First of A Kind) and beta customer engagements, including training strategy, diagnostics, spares planning, and remote support capabilities.

Drive closed‑loop feedback from customer fabs and internal labs into design improvements, product roadmaps, and reliability initiatives.

Packaging Applications Center of Excellence (PACE) Enablement

Provide executive oversight of the PACE Lab System availability in support of customer demonstrations, process characterization, benchmarking, and co‑development activities.

Ensure effective transfer of PACE Lab learnings to Field Service, Applications Engineering, and Engineering to accelerate time‑to‑value.

Maintain operational excellence, tool availability, and safety compliance within lab environments consistent with Onto Innovation standards.

Customer & Executive Engagement

Act as a senior technical interface for strategic global customers, supporting executive reviews, escalations, and joint development engagements.

Maintain a strong Voice‑of‑the‑Customer Mindset to influence internal priorities, investments, and continuous improvement initiatives.

Business & Operational Excellence

Partner with Global Service and Operations leadership to improve tool availability, reduce MTTR, and optimize cost of service.

Support development and deployment of predictive maintenance, upgrades, refurbishments, and service‑based offerings.

Contribute to service cost models, spares strategies, and operational KPIs aligned with Annual Operating Plan (AOP) objectives.

Talent & Organization Development

Build, lead, and mentor a high‑performing Technical Product Support Team and develop subject‑matter experts.

Establish clear role definitions, performance metrics, and technical career paths.

Foster a culture of accountability, collaboration, data integrity, and continuous improvement.

Qualifications

Bachelor’s degree in engineering, Physics, or a related technical discipline; advanced degree preferred.

15+ years of experience in semiconductor capital equipment with progressive leadership roles in technical support, service, applications, or engineering.

Strong technical foundation in lithography, inspection/metrology, and/or advanced packaging technologies, including panel‑level manufacturing.

Demonstrated experience supporting complex, high‑value CAPEX tools across global customer sites.

Proven ability to lead global, cross‑functional organizations and influence outcomes without direct authority.

Strong written and verbal communication skills, with the ability to engage credibly with executive‑level customers and internal stakeholders.

Willingness to travel internationally (25–30%).

Preferred Experience

Senior technical or service leadership experience at leading semiconductor equipment manufacturers.

History supporting FOAK tools, high‑volume product ramps, and large installed bases.

Exposure to advanced packaging and panel‑level manufacturing ecosystems, including OSAT and IDM customers.

Experience integrating lab‑based process development with field execution and customer enablement.

Leadership Competencies

Strategic and systems thinker with strong execution discipline

Customer‑centric and data‑driven decision maker

Comfortable operating across R&D, manufacturing, and customer environments

Effective change leader in complex, global organizations

Compensation & Growth

• Base Salary Range:

$155,200.00 - $232,800.00, offered in good faith and based on experience, location, and qualifications.

• Additional Rewards: Annual bonus opportunities and potential long-term incentives tied to both company and individual success.