Senior Heterogenous Integration Process Engineer
Location of position: Albany, NY
TEL Technology Center, America (TTCA) is TEL's advanced R&D center in the United States, driving innovation in next-generation semiconductor process technologies and equipment solutions. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges. From concept development to manufacturing enablement, our team develops innovative solutions that support future semiconductor technology roadmaps and advance semiconductor manufacturing worldwide.
Group/Role Overview
The 3DI Technology Group at TEL Technology Center, America (TTCA) develops next-generation heterogeneous integration and 3D device integration technologies for future semiconductor applications. Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies, enabling advanced architecture such as bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. As a 3DI R&D Engineer, you will lead the development of innovative process and equipment solutions through fundamental research, process development, and technology pathfinding. Working closely with leading customers, research partners, and TEL's global R&D teams, you will help define and enable the next generation of semiconductor integration technologies.
Responsibilities
- Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
- Define technical strategy and align R&D activities with business objectives.
- Collaborate with global teams, customers, and joint development partners.
- Conduct fundamental research and develop innovative processes and hardware solutions.
- Evaluate technology feasibility through modeling, simulation, and experimentation.
- Drive technology pathfinding for heterogeneous and 3D device integration.
- Mentor researchers and foster technical excellence across the organization.
- Provide technical leadership for customer engagements and internal development programs.
- Communicate technical results and recommendations to key stakeholders.
Qualifications- Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
- 5+ years of semiconductor R&D experience.
- Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
- Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
- Proven problem-solving, analytical, and experimental skills.
- Strong project management and organizational capabilities.
- Understanding of semiconductor technology roadmaps and industry trends.
- Excellent verbal and written communication skills.
- Strong record of technical innovation through publications, patents, or industry contributions.
- Demonstrated leadership in cross-functional technical programs.
- Ability to work effectively in a multicultural and global environment.
Travel: up to 20%Benefits:- Medical, Vision, and Dental Insurance
- Paid Personal Leave
- Holiday Time
- 401k Retirement Plans and Employer Matching
- Tuition Reimbursement
- Incentives for Healthy Lifestyles
- Employee Assistance Programs
The physical demands described herein are representative of those that must be met by an employee to successfully perform the essential functions of this job. This job operates in an office setting. This role routinely uses standard office equipment such as computers, phones, photocopiers, and filing cabinets. This is a largely sedentary role; however, some filing is required, which would require the ability to lift files, open filing cabinets and bend or stand as necessary. This position requires the ability to occasionally lift office products and supplies, up to 35 pounds. This position also requires 4 to 6 hours per day at a computer screen/keyboard.Salary Ranges$123,806.02 - $174,945.55
Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.
SubsidiaryTOKYO ELECTRON AMERICA, INC.
