Job DescriptionAbout the RoleTexas Instruments is seeking an operationally excellent and results-driven
Section Manager, Ramp & Sustaining Process Engineering to lead a team of experienced process engineers supporting TI's high-volume 300mm semiconductor manufacturing operations. In this leadership role, you will own aggressive tool install and process release schedules, drive cost leadership initiatives, maximize capacity from our existing install base, and ensure best-in-class sustaining of our high-volume production environment.
This role welcomes candidates from a variety of process engineering backgrounds, including Photolithography, Metrology, Implant, Epi Deposition, Diffusion, RTP, and other relevant unit process disciplines. Module ownership will be based on candidate experience. You will lead a diverse, cross-functional engineering team and partner closely with manufacturing, equipment, integration, and technology teams to deliver results that directly impact TI's capacity, cost position, and operational performance.
What You'll DoTeam Leadership & Organization Management- Lead, develop, and grow a team of process engineers focused on ramping and sustaining manufacturing operations
- Drive workforce planning, performance management, succession planning, and talent development within the section
- Foster a culture of operational excellence, urgency, innovation, and continuous improvement
- Mentor and develop engineers at all career stages, building long-term organizational depth and capability
Tool Install & Process Release Execution- Own and drive aggressive tool installation and process release schedules across your process modules and technology platforms
- Coordinate cross-functional execution across process engineering, equipment, integration, operations, and facilities teams to meet install milestones
- Establish scalable workflows and operational frameworks that accelerate process release cycles and improve schedule predictability
- Proactively identify and resolve technical and operational risks that could impact install and release timelines
Capacity Enablement & Cost Leadership- Lead innovative engineering solutions to extract maximum capacity from TI's current installed equipment base
- Identify and drive cost leadership projects that improve process efficiency, reduce consumable and materials costs, and optimize tool utilization
- Partner with operations to align capacity enablement strategies with factory production goals
- Develop and track key performance metrics that measure progress against capacity, cost, and productivity objectives
High-Volume Sustaining Operations- Provide best-in-class sustaining engineering support for TI's high-volume production processes across multiple technology nodes
- Own process excursion response, containment, and root cause resolution to minimize manufacturing disruptions and protect yield
- Drive continuous improvement in process stability, repeatability, and control across all supported process modules
- Maintain and strengthen process control systems, SPC governance, and manufacturing quality standards
Cross-Functional Collaboration & Executive Engagement- Partner with technology development, integration, yield, equipment, and operations teams to ensure seamless process ownership and operational readiness
- Provide regular updates on install schedules, process release status, capacity projects, and sustaining performance to senior and executive site leadership
- Represent the section in cross-site and corporate-level forums, benchmarking activities, and best-practice sharing initiatives
Innovation & Continuous Improvement- Champion data-driven and AI-enabled engineering approaches to improve process release velocity, sustaining effectiveness, and engineering productivity
- Drive adoption of standardized process engineering methodologies and best practices across all supported technology platforms
- Lead and contribute to continuous improvement programs that enhance factory capacity, process capability, and operational efficiency
QualificationsMinimum requirements:- Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field
- 5 years of direct engineering team leadership or management experience within a Semiconductor Manufacturing Environment.
Preferred qualifications:- Hands-on technical expertise in one or more semiconductor process modules (Photolithography, Metrology, Implant, Epitaxy, Diffusion, RTP, or equivalent)
- Experience managing tool installation programs and process release cycles in a 300mm high-volume manufacturing environment
- Demonstrated track record of delivering cost leadership and capacity improvement results at scale
- Familiarity with process control systems, SPC governance, and manufacturing quality frameworks
- Experience with AI-enabled engineering tools, advanced analytics, or digital transformation initiatives in a semiconductor manufacturing setting
- Background in sustaining engineering for analog, mixed-signal, or specialty semiconductor technologies
- Experience supporting multi-site or corporate-level manufacturing benchmarking and best-practice deployment
- Strong cross-functional collaboration, communication, and project management skills
- Proven ability to engage and present operational and program updates to site and executive leadership
About the TeamTI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
