Job Details:
Job Description:
We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.
Key Responsibilities
- Design of IC substrates using Siemens Xpedition IC package design software
- Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
- Deliver and disseminate design milestones to stakeholders
- Design validation and verification; including DRC and LVS
- Advanced packaging design integration (2.5D and 3D) with IC substrate
- Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams
- Communicate designs in presentations and relevant documentation
- Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers
As a successful candidate, you must possess
- Excellent communication and presentation skills for technical and non-technical audiences
- Strong analytical thinking and problem-solving capabilities
- Collaborative mindset with ability to work effectively across diverse teams
- Adaptability to work in a fast-paced, innovative research environment
- Passion for pushing the boundaries of quantum technology development
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of relevant industry job experience, internship experience and/or schoolwork/classes/research.
Minimum Qualifications:
B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
The experience must include:
- Siemens Xpedition design environment and workflow.
- High-speed signal routing.
- Experience with large form factor IC substrates.
Preferred Qualifications:
- 1+ years of experience with advanced routing engines for IC substrate design. Examples include AI and physics/model-based routing engines.
- Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $122,440.00-172,860.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
