Key Responsibilities:
Develop, implement, and maintain quality control procedures specific to BGA re-balling and rework processes.
Monitor and analyze process performance metrics to identify trends, root causes, and opportunities for continuous improvement.
Conduct first article inspections (FAI), in-process audits, and final inspections of re-balled BGA components.
Collaborate with engineering and production teams to ensure process capability and repeatability.
Lead failure analysis and corrective/preventive action (CAPA) activities related to BGA re-balling defects.
Maintain compliance with IPC standards (e.g., IPC-7711/7721, IPC-A-610), IEC TS 62647-4, and customer-specific requirements.
Support supplier quality initiatives for incoming BGA components and solder materials.
Document and maintain quality records, inspection reports, and process validation data.
Train operators and technicians on quality standards and inspection techniques for BGA re-balling.
Qualifications:
IMPORTANT INFORMATION: This position is in an ITAR-registered facility, US Person (US Citizen or US Permanent resident) status is a must.
Bachelor's degree in Engineering, Materials Science, or a related technical field is a plus.
Minimum 3 years of experience in a quality engineering role within the microelectronics or semiconductor industry.
Hands-on experience with BGA re-balling, X-ray inspection, soldering standards, and rework techniques.
Strong knowledge of IPC standards and electronic component handling.
Proficiency in statistical analysis tools (e.g., Minitab, JMP) and quality systems (e.g., ISO 9001, AS9100).
Excellent problem-solving, communication, and documentation skills.
Preferred Skills:
Experience with automated optical inspection (AOI) and X-ray inspection systems.
Familiarity with ESD controls.
Six Sigma Green Belt or higher certification is a plus.
Competitive salary and benefits package.
