Job Details:
Job Description:
The position will involve characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to expand analytical capabilities. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The position is responsible for TEM sample preparation, TEM sample imaging and analysis in high throughput environment.
The Engineer will be responsible for but not limited to:
oTechnical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.
oCollaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
oConducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel.
oContributes to continuous improvement efforts in high volume manufacturing environments.
oPerforms other related duties as required or as directed.
oContinuous upgrading of skill set; requires an open attitude and skills to learn from.
Qualifications:
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
oPhD degree in a Technical Area (Materials Science, Chemistry, Physics or comparable field).
oAt least 2 years of experience with Transmission Electron Microscopy (TEM) operation.
oAt least 1 year of experience with Python scripting or MATLAB or other programming languages.
Preferred qualifications:
oHands-on Experience with TEM sample preparation and/or TEM sample imaging with automation.
oHands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM.
oKnowledge of electron optics.
oKnowledge of semiconductor process integration.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
