Bachelor's degree in chemical engineering, materials science, mechanical engineering, or related field
2+ years of hands-on experience in semiconductor wafer processing, thinning, dicing, or die preparation
3+ years of semiconductor manufacturing experience preferred, especially with wafer back-grinding and mechanical dicing
Familiarity with SiC or other hard materials and die handling equipment
Experience with DOE, SPC, and data analysis tools like JMP or Minitab
Responsibilities
Develop and qualify wafer back-grinding and thinning processes, setting targets for thickness and minimizing defects
Optimize mechanical wafer dicing processes, selecting appropriate blades and parameters to control quality
Establish die cleaning and handling methods to maintain integrity and traceability
Develop laser marking processes for wafers and die, ensuring optimal contrast without damaging performance
Implement final package singulation methods while minimizing defects and confirming reliability
Run design of experiments (DOEs) and troubleshoot defects to ensure robust manufacturing processes
Benefits
Opportunity to work on cutting-edge technology in a fast-paced environment
Collaborative work culture with cross-functional teams
Potential for professional growth within a leading aerospace and technology company
Hands-on experience with advanced semiconductor processes
Travel opportunities for supplier and manufacturing support
Full Job Description
PROCESS ENGINEER, WAFER PREPARATION & ASSEMBLY (STARLINK/AKOUSTIS)
Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth.
We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement the full wafer-to-die preparation flow: wafer thinning and backside processing, dicing, die cleaning and handling, laser marking, inspection, and final package singulation. You will work directly with equipment and cross-functional partners (package engineering, assembly, test, reliability, quality, and external manufacturers) to deliver high-quality die that support downstream yield and reliability.
RESPONSIBILITIES
Develop and qualify wafer back-grinding, thinning, stress-relief, and backside finishing processes; set thickness, TTV, bow, warp, and roughness targets while minimizing chipping, cracking, subsurface damage, and edge defects
Develop and optimize mechanical wafer dicing (including thin wafers and difficult materials such as SiC); select blades, tapes, and parameters (speed, feed, depth, coolant, dressing, single- or multi-pass) and control chipping, sidewall quality, delamination, and street/exclusion requirements
Establish post-dice die cleaning, drying, handling, tape mount/release (UV and non-UV), pick, sort, and presentation methods that protect die integrity, orientation, and traceability for flip-chip, wire-bond, and other assembly flows
Develop and qualify laser marking processes for wafers and bare die (including green/UV sources); optimize mark contrast and resolution while avoiding damage to electrical performance, metallization, passivation, or mechanical integrity, and implement vision/OCR verification
Develop final package singulation (saw, laser, or mechanical) for organic, mold, ceramic, and metal structures; minimize cracking, chipping, delamination, burrs, and edge defects and confirm impact on warpage, electrical performance, and reliability
Run DOEs, define process windows and controls, troubleshoot defects, qualify equipment and consumables, incorporate supplier and production feedback, and transfer robust processes into manufacturing
BASIC QUALIFICATIONS
Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
2+ years of hands-on experience in semiconductor wafer processing, thinning, dicing, die preparation, or manufacturing (Internship or extracurricular experience is applicable)
PREFERRED SKILLS AND EXPERIENCE
3+ years of hands-on semiconductor manufacturing experience, including wafer back-grinding/thinning (including ≤150 µm wafers) and mechanical dicing/blade selection
Experienced in operating and developing processes on semiconductor equipment, plus solid understanding of wafer and die handling, process troubleshooting, and statistical process control
Experience with SiC or other hard materials, dicing tapes, blade dressing, two-step or partial-depth cutting, thin-film wafers, and die pick/handling equipment
Laser marking of wafers or die (green, UV, or similar) and machine-vision/OCR mark verification.
Package singulation and understanding of warpage, stress, cracking, chipping, and delamination mechanisms
DOE, SPC, Cp/Cpk, FMEA, or Six Sigma; data analysis with JMP, Minitab, MATLAB, or Python.
Equipment qualification, process transfer, OSAT/external partner support, and familiarity with JEDEC, SEMI, or IPC standards
CAD familiarity (AutoCAD or SolidWorks) is a plus
ADDITIONAL REQUIREMENTS
Onsite in Bastrop, TX (not remote or hybrid)
Up to 20% domestic and international travel for supplier and manufacturing support
Willingness to work extended hours or weekends to support key milestones
Ability to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks (including lifting up to 25 lbs and handling wafers, substrates, packages, and tooling)
Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management
ITAR REQUIREMENTS:
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. a7 1157, or (iv) Asylee under 8 U.S.C. a7 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
About SpaceX
SpaceX is an American aerospace manufacturer and space transportation services company founded in 2002 by entrepreneur Elon Musk. The company designs, manufactures, and launches advanced rockets and spacecraft. SpaceX has developed the Falcon 1, Falcon 9, Falcon Heavy, and Dragon spacecraft. The company was founded with the goal of reducing space transportation costs and enabling the colonization of Mars. SpaceX has achieved several milestones in spaceflight, including the first privately-funded liquid-propellant rocket to reach orbit, the first privately-funded company to send a spacecraft to the International Space Station, and the first privately-funded company to send a human-rated spacecraft to orbit.
