Process Engineer

Primary Responsibilities

• Candidate will develop, document, and execute manufacturing processes and procedures for electronic products.
• Candidate will support production of printed circuit board assemblies through various processes.  Processes include SMT, Through Hole Selective Solder, Press fit, Conformal Coating and a variety of other processes related to PCBA manufacturing.
•  Applicant will work with a multi-disciplinary team to develop a wide variety of hardware, and work with the latest automated technology used in assembly and test equipment.
• Candidate will support tasks such as creating machine programs and overseeing the execution of manufacturing activities.
• Candidate will be required to work closely with the operations team to complete all details of the assembly, and ultimately to prepare the assembly for delivery to customer.
• Candidate will also work closely with our manufacturing team including engineering, operations, and quality team to develop processes that validate customer quality requirements.
• Candidate will work closely with production control to meet desired delivery schedule

Basic Qualifications

• Requires a BS degree and 2-4 years of prior relevant experience or Masters with 0-2 years of prior relevant experience. In lieu of a degree, a highschool diploma/GED with 6 years of experience will be considered

• Experience with Costpoint Material Planning software and/or Agile/Windchill product lifecycle management software is a plus. Experience in various quality roles is also a plus. Experience in using Manufacturing Execution Systems (MES) is also a plus.
• Candidate must be able to demonstrate strong leadership skills, attention to detail, and ability to work independently.  Ability to multi-task well is also essential.
• Candidate must have experience working with design engineers, manufacturing engineers, and technicians to develop a build strategy and identify any problems that could occur during assembly.
• Candidate will be required to have the basic computer skills associated with these assembly tasks (such as retrieving the manufacturing documentation from the system, updating the system as router steps are completed, etc.).
• Candidate must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area.
• Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance OR meet the eligibility to obtain (and maintain) a Secret Clearance

Preferred Qualificaations

• Preferred candidate will have at least 2 years of manufacturing experience on programs building electronic hardware to government specifications (or similar).
• Preferred candidate will have experience in the following processes and equipment: ASM pick and place, DEK screen printers, BTU ovens, PVA coating machine, Pillarhouse or JUKI selective solder.
• Experience with software that maintains bills of materials, and other engineering design data.
• Experience with electronics used on launch vehicles, targets, or missile components, and with production of cable harnesses, electronics, and electromechanical assemblies.
• Experience in various quality roles is also a plus.
• Experience in using Manufacturing execution systems (MES) is also a plus.
• Electronic component handling requirements and ESD procedures.
• Current or prior certification to IPC/WHMA-A-610 & J-STD-001.

The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.