Bachelor's degree in chemical engineering, materials science, mechanical engineering, or related field
2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience
3+ years of advanced packaging experience preferred, especially with GGI
Experience with thermosonic flip-chip bonding and gold interconnects
Familiarity with DOE, SPC, and root-cause analysis methodologies
Knowledge of inspection and metrology techniques
Experience with CAD and data analysis tools is a plus
Responsibilities
Develop and qualify GGI and thermosonic flip-chip processes, establishing process windows through DOE
Optimize vacuum mold lamination and troubleshoot encapsulation issues
Support assembly steps including wafer handling, placement, and inspection
Select and characterize assembly materials for performance and reliability
Specify and qualify assembly equipment with suppliers
Conduct DOEs and write process specifications and control plans
Drive NPI from prototype to production, performing root-cause analysis
Benefits
Opportunity to work on cutting-edge technology in a dynamic environment
Hands-on role with direct impact on production processes
Collaboration with a diverse team of engineers and suppliers
Potential for travel to support manufacturing and supplier relationships
Engagement in a mission-driven company focused on global connectivity
Full Job Description
PROCESS ENGINEER, GOLD-TO-GOLD INTERCONNECT & FLIP-CHIP ASSEMBLY (STARLINK/AKOUSTIS)
Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth.
We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners.
RESPONSIBILITIES
Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength
Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability
Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed
Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection
Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability
Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers
Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports
Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies
BASIC QUALIFICATIONS
Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable)
PREFERRED SKILLS AND EXPERIENCE
3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination
DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp
CAD (AutoCAD) and familiarity with simulation tools (ANSYS, COMSOL, or similar) is a plus; data analysis with JMP, Minitab, MATLAB, or Python is a plus
Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor
ADDITIONAL REQUIREMENTS
Onsite in Bastrop, TX (not remote or hybrid)
Up to 20% domestic and international travel for supplier and manufacturing support
Willingness to work extended hours or weekends to support key milestones
Ability to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks (including lifting up to 25 lbs and handling wafers, substrates, packages, tooling, and assembly samples)
Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management
ITAR REQUIREMENTS:
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. a7 1157, or (iv) Asylee under 8 U.S.C. a7 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
About SpaceX
SpaceX is an American aerospace manufacturer and space transportation services company founded in 2002 by entrepreneur Elon Musk. The company designs, manufactures, and launches advanced rockets and spacecraft. SpaceX has developed the Falcon 1, Falcon 9, Falcon Heavy, and Dragon spacecraft. The company was founded with the goal of reducing space transportation costs and enabling the colonization of Mars. SpaceX has achieved several milestones in spaceflight, including the first privately-funded liquid-propellant rocket to reach orbit, the first privately-funded company to send a spacecraft to the International Space Station, and the first privately-funded company to send a human-rated spacecraft to orbit.
