Process Engineer - Dry Etch

Ignite Human Capital

$100K — $150K *
Aerospace & Defense
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5-10 years of experience in dry etch processing (RIE, DRIE, MRIE, ICP, microwave ashing)
  • Proficient in Statistical Process Control (SPC)
  • Data analysis and reporting skills
  • Basic understanding of semiconductor processing
  • Strong problem-solving and troubleshooting abilities
  • Experience with process maintenance and recipe creation
  • Bachelor's degree in relevant field; advanced degrees reduce experience requirements

Responsibilities

  • Collaborate with teams to run experiments and tune processes
  • Support new product/process introductions for consistent performance
  • Guide process technicians through complex steps
  • Interpret metrology results and advise teams accordingly
  • Report findings and provide shift updates to ensure seamless operations
  • Continuously improve wafer fabrication processes
  • Partner with engineering and operations teams to enhance tool availability and yield

Benefits

  • Medical, dental, and vision insurance
  • 401(k) plan with company contributions
  • Company-paid life and disability insurance
  • Paid holidays and vacation time
  • Opportunities for overtime
Full Job Description
Process Engineer - Dry Etch

San Diego / Riverside, CA

Salary: $100,000 - $150,000 DOE

About the Role

We're seeking a Dry Etch Process Engineer to support the development of manufacturable, repeatable, and high-yielding processes for advanced, highly specialized devices spanning aerospace, defense, bioelectronics, and high-speed communications. This is a hands-on role at the leading edge of silicon photonics, where your work directly shapes the performance and quality of next-generation product lines.

What You'll Do
  • Collaborate with integration engineers, customers, and development engineers to run experiments and tune processes for fab operation
  • Work alongside product engineering and integration teams to ensure smooth new product/process introductions and consistent device performance
  • Guide and support process technicians through complex process steps
  • Interpret metrology results and disposition lots against defined pass/fail criteria
  • Summarize and report metrology findings, advising the integration and process development teams
  • Deliver clear shift pass-downs to keep dry etch operations running without interruption
  • Sustain and continuously improve wafer fabrication processes
  • Partner with equipment engineering, operations, and management to strengthen cycle time, tool availability, quality, and yield
  • Maintain working knowledge of all applicable codes and standards for assigned equipment using document control, work instructions, and manufacturing execution systems (MES)
  • Ensure manufactured products meet specification and application requirements
  • Resolve technical deviations by forming hypotheses, designing validating experiments, identifying root causes, implementing corrective actions, documenting improvements, and training operations
  • Sustain established processes across RIE, DRIE, MRIE, ICP, microwave ashing, TCP, DRM, and barrel etching - including recipe creation, inspection, defect control, and standard metrology (e.g., ellipsometry, profilometry)
  • Author and maintain operating specifications for production processes and equipment
  • Monitor process health via Statistical Process Control (SPC) and act on out-of-control events per established action plans

What You'll Bring
  • Fab experience in dry etch processing using RIE, DRIE, MRIE, ICP, and microwave ashing
  • Working experience with Statistical Process Control (SPC)
  • Comfort with data extraction, analysis, and reporting
  • Foundational understanding of semiconductor processing and algebraic concepts
  • Ability to troubleshoot problems and drive to root cause
  • Understanding of the maintenance activities needed to keep a process healthy and repeatable
  • Ability to plan, prioritize, and manage multiple overlapping tasks against deadlines
  • Hands-on capability to operate processing tools, write and run dry etch recipes, inspect wafers under a microscope, and perform particle/defect and thickness/uniformity characterization
  • Availability for offset shifts - Front-End Days (Sun-Thu) or Back-End Days (Tue-Sat)
  • BS in Electrical Engineering, Materials Science, Physics, Chemistry, or related field + 9 years; MS + 7 years; or PhD + 4 years

Competencies

Hands-on mindset • strong communication • collaboration • quick learner • strong interpersonal skills • self-starter • prioritization • accountability • innovation

Work Environment

More than 80% of the work takes place in the fab - a temperature-controlled cleanroom requiring full-body gowning, over-boots, over-hood, safety glasses, and additional PPE. Expect frequent gowning/de-gowning, potential exposure to hazardous materials, and an environment with static noise and both auditory and visual alarms.

Physical Demands
  • Prolonged periods (up to ~3 hours) stationary, seated, standing, or walking the fab
  • Extended computer monitor viewing
  • Occasional pushing/pulling and lifting of 50+ lb objects (e.g., tool components), with occasional short carries
  • Frequent reaching, bending, twisting, squatting, kneeling, and stooping to access tools
  • Repetitive wrist/hand/finger motions; work in tight or confined spaces
  • Fine and gross motor handling for carrying cassettes and lot boxes
  • Constant PPE use

Compensation

Total compensation includes base salary plus overtime eligibility for non-exempt roles, along with a comprehensive benefits package (medical, dental, vision, 401(k), company-paid life and disability, paid holidays and vacation, and more).

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