Job OverviewWe are seeking a Systems Packaging & Assembly Engineer to lead the development and integration of advanced packaging and assembly solutions for our MEMS-based silicon photonics switching platform.
This role sits at the intersection of device engineering, packaging architecture, manufacturing engineering, and supply chain, driving packaging solutions from concept through high-volume production.
The ideal candidate is a hands-on packaging expert with deep experience in optical modules, MEMS devices, semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional programs with OSATs, contract manufacturers, and internal engineering teams.
This is a highly visible role responsible for bridging R&D and manufacturing, ensuring that our packaging architecture enables scalable production of high-performance optical switching systems.
Key ResponsibilitiesPackage Design & System Integration- Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.
- Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces.
- Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability.
- Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces.
Assembly Process Development- Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.
- Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI.
- Establish process flows, BOM structures, and manufacturing documentation for new products.
- Identify opportunities for yield improvement, cost reduction, and cycle-time optimization.
NPI & Manufacturing Ramp- Lead New Product Introduction (NPI) activities from prototype builds through production ramp.
- Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements.
- Drive process qualification, yield ramp, and reliability validation.
- Implement root cause analysis (RCA), corrective actions, and failure analysis workflows.
Supplier & Manufacturing Partner Management- Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners.
- Lead technology transfer from engineering to manufacturing partners.
Program Management- Act as a technical program manager for packaging and assembly development across multiple engineering teams.
- Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain.
- Track program milestones and ensure packaging readiness aligns with product development timelines.
Required Qualifications- Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
- 15+ years of experience in semiconductor or photonics packaging engineering.
- Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.
- Strong background in advanced packaging technologies, such as:
- Flip-chip and wirebond hybrid assemblies
- BGA / FCBGA / CSP / WLCSP
- Multi-die stacking (2.5D / 3D integration)
- System-in-Package (SiP)
- Proven experience driving NPI programs from concept to high-volume production.
- Hands-on experience working with OSATs and contract manufacturers.
- Strong knowledge of yield improvement, failure analysis, and process development.
- Demonstrated ability to lead projects and guide engineers as a senior technical contributor.
- Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).
- Strong background in materials characterization and statistical process control (DOE, FMEA, SPC)
Preferred Experience- Experience with fiber attach and photonic IC packaging.
- Background in optical transceivers, co-packaged optics, or photonics modules.
- Experience with optical modules, photonics packaging, and/or MEMS devices.
- Experience with optical alignment and hermetic packaging solutions.
- Six Sigma certified
- Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.)
$180,000 - $240,000 a year
Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements.
