Tenstorrent is seeking talented Physical Design Engineers to implement high-performance partitions for an industry-leading AI SOC. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team.
This role is hybrid, based out of Austin,TX or Santa Clara, CA or Fort Collins, CO.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who you are- Experienced with synthesis and place-and-route flows, especially using Synopsys Design Compiler / Fusion Compiler and IC Compiler II.
- Comfortable in a small, cross-functional physical design team, owning a block or subsystem and partnering on tapeout milestones with clear communication and accountability.
- Ideally bring extra depth in areas such as UPF/multi-voltage power domains, SoC interface IP integration (e.g. I3C, UART), signoff breadth (DRC/LVS, EM/IR, LEC/Formality), multi-clock/CDC-aware implementation, PLL/DLL integration, and DFT-aware physical implementation (OCC/MBIST).
What we need- Execute synthesis, PNR, and STA for assigned partitions of a complex AI SoC.
- Help close EM/IR, ensure UPF power intent is consistent with implementation, and drive LEC and physical verification signoff for your partitions in coordination with methodology owners.
- Work closely with architects, RTL designers, and DFT engineers to resolve implementation and signoff issues across your blocks.
What you will learn- How to implement and close AI SoC partitions end-to-end, including power intent, timing, and physical signoff in a modern Synopsys-based flow.
- Deeper expertise across signoff domains: EM/IR, DRC/LVS, logical equivalence (LEC/Formality), and CDC-aware implementation on meaningful production blocks.
- Practical integration of analog/mixed-signal macros (PLL/DLL), DFT features (OCC/MBIST), and SoC interface IP within advanced physical design flows and collaborative tapeout environments.
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
