Photomask Dry Etch Engineer

Toppan Photomasks Round Rock, Inc.

$95K — $115K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical, Chemical, or Mechanical Engineering, Physics, Chemistry, or a related field.
  • 3+ years of experience in Dry Etch Process Engineering or relevant advanced degree with semiconductor thesis.
  • Strong troubleshooting skills and experience in root-cause analysis and corrective actions.
  • Experience in process development, including DOE and continuous improvement methodologies.
  • Proven track record in defect reduction and yield improvement initiatives.
  • Hands-on experience with tool ownership, equipment troubleshooting, and maintenance optimization.
  • Proficient in data analysis tools and basic scripting or coding skills.

Responsibilities

  • Support and sustain plasma-based dry etch processes for photomask manufacturing.
  • Define equipment requirements and optimize plasma etch performance.
  • Drive the introduction of new dry etch technologies into production.
  • Collaborate with operations and technical teams for process integration.
  • Continuously improve yield, cycle time, and overall product quality.
  • Conduct frequent troubleshooting and implement preventive and corrective actions.
  • Manage multiple priorities and projects effectively while ensuring timely communication.

Benefits

  • Comprehensive health insurance plan.
  • 401(k) with company match.
  • Flexible working hours and remote work options.
  • Professional development and training opportunities.
  • Collaborative work environment with cross-functional teams.
Full Job Description
Job description:

The Dry Etch Process Engineer will serve as a key technical contributor supporting plasma-based dry etch processes for photomask manufacturing. As part of the etch engineering team, this role is responsible for daily process sustaining, defining equipment requirements, optimizing plasma etch performance, and driving the introduction of new dry etch technologies into production. The engineer will work closely with operations and technical development teams to ensure robust process integration and to continuously improve yield, cycle time, and overall product quality.

Education/Experience Requirements
  • Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, or a related engineering discipline.
  • 3+ years of Dry Etch Process Engineering experience in high-volume semiconductor manufacturing or new grad with advanced degree and semiconductor-related thesis work.
  • Strong troubleshooting capability, including root-cause analysis (5 Whys, Model-Based Problem Solving) and implementation of corrective and preventive actions (8D).
  • Experience in process development and continuous improvement methodologies, such as DOE, statistical data analysis, APC, recipe management, SPC, and OCAP creation.
  • Demonstrated success in defect-reduction, CD-variability-reduction, and yield-improvement initiatives.
  • Hands-on tool ownership experience, including equipment troubleshooting, preventive maintenance optimization, FMEA, and FDC utilization.
  • Proficient in data analysis using tools such as JMP and Excel, with basic scripting or coding skills (VBA, JSL, Python, SQL).
  • Basic familiarity with surface characterization techniques (e.g., SEM/EDX, AFM/profilometry, ToF-SIMs, XPS, etc.): when to use what technique and how to interpret the data.
  • Familiarity with project management tools (e.g., Gantt charts) and the ability to manage multiple priorities simultaneously.
  • Excellent verbal and written communication skills, with the ability to interface effectively with personnel at all organizational levels-from equipment operators to senior leadership.
  • A self-starter with strong attention to detail, solid organizational skills, and a collaborative mindset.

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