Micron Technology

MTS Process Integration Engineer | APTD Die Level Technology

Micron Technology • $110K — $130K *
Boise, ID 83709In-Person
Consumer Technology
8 - 10 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Bachelor's degree in Materials or Chemical Engineering with 8+ years experience in advanced packaging technology development.
  • Proficient in TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes.
  • Skilled in hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer methodologies.
  • Experience in integrating HBM with logic, focusing on thermal optimization.
  • Demonstrated ability to support cross-functional engineering programs in fast-paced environments.

Responsibilities

  • Develop and optimize advanced packaging technologies such as 2.5D/3D integration and HBM.
  • Design and execute experiments for process qualification and material selection.
  • Analyze yield and defect data to implement process improvements through advanced analytics.
  • Drive technology transfer and ensure manufacturing readiness.
  • Conduct warpage engineering to mitigate wafer/die warpage through modeling and validation.
  • Collaborate across teams to deliver high-performance packaging solutions.

Benefits

  • Comprehensive medical, dental, and vision plans tailored to individual healthcare needs.
  • Income protection benefits for illness or injury, along with paid family leave.
  • Robust paid time-off program plus paid holidays for work-life balance.
Full Job Description
Position Overview:

As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions.

Responsibilities:

  • Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
  • Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
  • Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
  • Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
  • Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure-shrinkage controls, and material/process levers; validate with inline metrology.
  • Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions


Minimum Qualifications:

  • Bachelor's degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
  • Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
  • Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
  • Experience with HBM and logic integration, including thermal optimization
  • Experience supporting cross-functional engineering programs in a fast-paced development environment


Preferred Qualifications:

  • Master's degree or PhD in Materials Engineering, Chemical Engineering, or a related field
  • Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies
  • Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency
  • Experience authoring technical papers, patents, or engineering documentation


As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

About Micron Technology

Micron Technology Careers

Join the vibrant team at Micron Technology, a leader in memory and storage solutions, and propel your career into the future of technology. At Micron, we are committed to fostering a culture of diversity and innovation, offering a range of job opportunities that encourage professional growth and leadership development.

Work You’ll Do

At Micron Technology, you will collaborate with some of the brightest minds in the industry, working on groundbreaking projects that redefine how the world uses information to enrich life. Our team is dedicated to leading through a unique position in the marketplace, at the intersection of technology, industry expertise, and digital innovation.

Explore Micron Technology’s Career Opportunities

Whether you are looking for an internship, a full-time position, or a leadership role, Micron offers a path to personal and professional growth. We are hiring across multiple disciplines, seeking passionate, curious, and innovative team players.

Innovative Work

Join our global team of professionals and be part of a company that values innovation and leadership. Micron provides targeted solutions and technologies that are integral to advancing how the world works, learns, and plays.

Be Part of a Great Team

Experience Micron’s inclusive culture where we value diversity and provide extensive benefits to ensure the well-being of all our team members. Engage in networking opportunities within the company to expand your skills and advance your career.

Future-Proof Your Career

Micron is dedicated to your career development, offering unmatched training, development programs, and certification support to help you reach your goals. Our commitment to innovation and leadership in the memory and storage industry ensures that your work at Micron is not just a job, but a pathway to future opportunities.

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Learn more about Micron Technology
Size
43,000 employees
Market Cap
$53.7 billion
Industry
Manufacturing & Automotive
Net Income
$2.9 billion
Founded
1978
5 Year Trend
+8.6%
Revenue
$22 billion
NASDAQ
MU
* Ladders Estimates

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