Mechanical Design Engineer

Sanmina-SCI

$100K — $150K *
Telecommunications & Hardware
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Engineering
  • 5+ years in product development focusing on transceiver design
  • Proficient in AutoCAD/SolidWorks and FEA software
  • Experience designing RF/Microwave/Optical packages and multi-chip modules
  • Familiarity with optical and microelectronic technologies
  • End-to-end product development experience, manufacturing implementation preferred
  • Strong communication skills, both written and verbal

Responsibilities

  • Design mechanical housing subassemblies for high-speed optical modules
  • Integrate PCBs and optical components, ensuring effective routing
  • Ensure designs meet manufacturability, assembly, and testing standards
  • Conduct design verification through prototyping and testing
  • Define tooling requirements for prototype and production
  • Collaborate with multidisciplinary teams for design support
  • Engage with customers to gather requirements and develop proposals

Benefits

  • Opportunities for participation in cutting-edge technology development
  • Collaboration with a global team on innovative products
  • Flexible work environment that empowers personal contributions
  • Commitment to professional growth and ongoing learning
  • Supportive workplace with an inclusive culture
Full Job Description
Job Purpose
The Mechanical Design Engineer, as part of the larger product solutions development team, provides mechanical design support of product development, NPI, and manufacturing of a variety of different optical product families.


We are looking for an experienced Mechanical Engineer, with a strong background in mechanical design, and a clear focus on the physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP, to support product design and analysis within a worldwide end-to-end product development team developing advanced Opto/microelectronic components, modules and sub-systems.

Nature of Duties / Responsibilities
  • Physical design, thermal management and packaging of high-speed optical modules, in small form factors such as QSFP, OSFP. Experience with CPO design approaches and architectures an asset. Responsibilities include:
    • Mechanical housing subassembly design and module integration, PCB packaging and flex circuit integration, optical fiber routing and interconnects
    • Host system integration considerations of pluggables: insertion/extraction forces, mating cycles, air vs liquid cooling
    • Design for manufacturability, assembly and test to ensure high volume product viability and reliability
    • Design verification through prototyping and device test and characterization
    • Tooling and fixturing requirements definition and design to support prototyping and volume production
    • Supplier engagement to support prototyping and high volume production
  • Work within a multidisciplinary development team to provide a broad range of mechanical design solutions and analysis support to meet design specifications. Product types, include, but are not limited to:
    • Telecommunications and datacom components/modules/subsystems (transceivers, lasers, detectors, modulators, optical receivers, amplifiers, flip chip BGA modules, etc).
    • Sensing / lidar optical components/systems.
    • Medical, biomedical, military etc components.
  • Coordinate activities within the multidisciplinary development team
  • Work with process and test engineering teams to ensure alignment of designs with process and test capabilities
  • Support new business development by interfacing with new customers to understand their requirements and defining proposals and quotations
  • Support new technology research and development as part of AMTs Technology Roadmap
  • Manage key technical elements of projects and their associated timelines in order to meet milestones on various customer projects.

Education & Experience
  • Minimum bachelors degree in Engineering
  • 5+ years' experience in a product development role with a focus on transceiver design
  • AutoCAD/SolidWorks design experience with an understanding of FEA using Solidworks / Ansys or similar software tools
  • Experience in the design of RF/Microwave/Optical packages and multi-chip modules
  • Experience in optical and microelectronic technologies, materials, components, assembly and test processes
  • Experience in end-to-end product development, with product manufacturing implementation considered an asset
  • Experience with DFM and FMEA would be an asset
  • Ability to work well within a multidisciplinary development team in a fast-paced environment
  • Strong written and verbal communication skills are required


OTHER INFORMATION
  • The compensation range for this position is $100,000-150,000 annually.
  • This position is for an existing vacancy.
  • The hiring process for this position does not use Artificial Intelligence (AI).

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