Job DetailsAs a Manufacturing Engineer, you will play a critical role in developing, optimizing, and maintaining manufacturing processes for laser diode devices, with a strong focus on assembly, interconnect, and packaging technologies. This role supports high-yield, high-reliability production by driving improvements in wire bonding, soldering, automation, and equipment performance.
Responsibilities:- Develop, qualify, and sustain wire bonding processes for laser diode die attach and packaging (e.g., Au ball bonding, wedge bonding).
- Optimize precision soldering processes for die attach, sub-mount attach, and optical subassembly integration.
- Operate, program, and maintain Fineplacer systems for high-precision die placement, alignment, and bonding.
- Own and optimize process recipes for vacuum soldering systems and thermal processing equipment, including reflow, annealing, cure cycles, and temperature uniformity.
- Implement automation solutions to increase consistency, reduce cycle time, and improve process control.
- Create detailed manufacturing documentation: work instructions, standard operating procedures, control plans, and PFMEAs.
- Conduct root cause analysis for bonding or soldering defects and implement corrective actions.
- Collaborate with R&D to transition new laser diode designs into scalable, production-ready processes.
- Monitor SPC data, yields, and critical process parameters to identify improvement opportunities.
- Support equipment calibration, maintenance, and capability evaluations.
- Work with quality and operations to ensure devices meet electrical, optical, and reliability specifications.
Minimum Qualifications:- Bachelor's Degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or related field.
- 8+ years of experience in semiconductor packaging, photonics assembly, or precision microelectronics manufacturing.
- Hands-on experience with wire bonding equipment and process controls.
- Experience with high-precision soldering, reflow profiles, and thermal process equipment.
- Proficiency with Fineplacer systems (or equivalent micro-assembly platforms).
- Familiarity with automated assembly systems and process automation methodologies.
- Strong data analysis skills using tools such as JMP, Minitab, MATLAB, or Python.
- Ability to interpret device performance data (LIV curves, wavelength, thermal behavior) and relate it to assembly processes.
Preferred Qualifications:- Master's Degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or related field.
- Certification in Lean Manufacturing, Six Sigma, or similar process improvement methodologies.
- Knowledge of precision assembly and optical alignment.
- Previous experience in a low-volume high mix manufacturing environment.
- Advanced problem-solving and project management skills.
- Experience with data acquisition systems, instrumentation, and automated test equipment.
