We are seeking an experienced System Signal Integrity and Power Integrity Engineer Lead to solve complex, high-impact integrity challenges in next-generation AI compute systems. This role is focused on deep technical analysis and hands-on problem solving across high-speed interfaces, power delivery networks, rigid and flex interconnects, and advanced packaging.
The ideal candidate is a technical expert engaged to resolve difficult SI/PI problems spanning silicon, package, PCB, flex, and connector domains.
Key Responsibilities:
- Solve complex signal integrity and power integrity problems for high-speed AI compute platforms, including chip-to-chip and chip-to-board interfaces.
- Perform advanced pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, rigid-flex assemblies, connectors, and advanced packages.
- Lead root-cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation-to-hardware mismatches.
- Analyze and resolve SI/PI challenges associated with flex circuits, high-speed flex connectors, interposers, and advanced packaging technologies.
- Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.
- Define and refine PCB, rigid-flex, and flex circuit stack-ups, material selections, and impedance structures as required to meet performance targets.
- Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend targeted design changes.
- Work closely with silicon and package design teams to resolve SI/PI issues related to bump/ball assignments, package-to-PCB transitions, and interface interactions.
- Act as a technical escalation point for complex SI/PI issues across multiple programs.
Minimum Qualifications:
- Master's degree in Electrical Engineering.
- 15+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high-speed hardware systems.
Required Experience and Skills:
- Deep expertise in high-speed serial and parallel interface analysis and debug.
- Strong hands-on experience with PCB, rigid-flex, and flex circuit stack-up design and analysis.
- Advanced SI/PI analysis of flex connectors, high-density interconnects, and advanced packaging technologies.
- Proficiency with 2D and 3D electromagnetic simulation tools.
- Power delivery network analysis, simulation, and lab correlation at the system level.
- Strong grounding in transmission line theory, microwave engineering, and high-speed design fundamentals.
- Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes.
-Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product, GPU, CPU, TPU, server platform etc.
Additional Information:
- Experience with large-scale AI or high-performance compute systems is preferred.
Location: Sunnyvale, CA
The base salary range for this position is $220,000 to $250,000+ annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.
Apply today and become part of the forefront of groundbreaking advancements in AI!
