PhD or MS in Mechanical Engineering, Applied Physics, or related field focusing on Heat Transfer and Fluid Dynamics.
8+ years of experience in thermal management for electronics, particularly with high-TDP processors or high-performance server systems.
Expertise in thermal simulation tools, with a strong grasp of underlying physics and their transformative potential in simulation methods.
In-depth knowledge of AI hardware roadmaps, OCP standards, and the shift from air to liquid cooling.
Established network within the semiconductor and data center industries.
Responsibilities
Define strategy and product roadmap for optimizing solver technology in thermal management.
Act as the primary subject matter expert (SME) for chip cooling, linking solver developers and hardware architects.
Architect solutions for Tier 1 semiconductor companies and hyperscalers to address complex thermal issues.
Showcase the advantages of fast-cycle simulation compared to legacy CFD tools to industry leaders.
Recruit and mentor a team of thermal application engineers as the portfolio in the semiconductor space expands.
Benefits
Competitive compensation with equity in a fast-growing startup.
Comprehensive medical, dental, and vision health insurance.
401(k) contributions.
Gym allowance to support employee wellness.
Collaborative work environment with intelligent and supportive colleagues.
Full Job Description
Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America.
The Mission
The semiconductor industry is hitting a "thermal wall." As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.
Key Responsibilities
Strategy & Product Roadmap: Define how Flexcompute's solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute's simulation platform.
Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.
Requirements
Education: PhD or MS in Mechanical Engineering, Applied Physics, or a related field with a focus on Heat Transfer and Fluid Dynamics.
Experience: 8+ years in thermal management for electronics. You have likely led thermal architecture for high-TDP processors or high-performance server systems.
Simulation Mastery: Expert-level proficiency in thermal simulation tools. You must understand the underlying physics well enough to articulate why a GPU-accelerated or novel solver approach is transformative.
Industry Knowledge: Deep familiarity with the roadmap of AI hardware, OCP (Open Compute Project) standards, and the transition from air to liquid cooling.
The Ideal Candidate
You are frustrated by the slow turnaround times of current CAE software.
You have the network to open doors at major foundries and data center equipment manufacturers.
Benefits
Competitive compensation with equity of a fast-growing startup.
