AeroVironment

Lead Engineer – RF Engineering

AeroVironment$111K — $158K *
Aerospace & Defense
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in electrical engineering or related engineering field.
  • 5+ years in RF/microwave and mixed-signal PCB development for high-reliability products.
  • Proven expertise in RF board layout for multiple frequency bands (L/S/C/X/Ku/Ka).
  • Hands-on experience with hybrid stack-ups, controlled impedance design, and thermal/shielding practices.
  • Proficiency with ECAD suites (Altium, Cadence, Mentor) and analysis tools (Keysight ADS, Ansys HFSS).
  • Strong RF measurements experience including S-parameters and linearity metrics.
  • Ability to obtain a DoD Top-Secret/SCI clearance.

Responsibilities

  • Define multilayer RF stack-ups to meet performance targets.
  • Partition boards with attention to shielding, grounding, and thermal management.
  • Establish and enforce RF layout rules and high-speed constraints.
  • Perform signal integrity and power integrity simulation and verification.
  • Lead schematic capture and manage ECAD library governance in relevant tools.
  • Run design reviews, driving closure of action items and maintaining design histories.
  • Collaborate with PCB manufacturers on fabrication and assembly issues.

Benefits

  • Medical, dental, and vision insurance.
  • 401K with company matching.
  • 9/80 work schedule for improved work-life balance.
  • Company-wide paid holiday shutdown.
Full Job Description

Worker Type

Regular


Job Description

We are seeking an RF PCBA Design and Test Engineer for the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products. You will own the PCB lifecycle—from stack-up definition and layout governance through fabrication, assembly, bring-up, release, and test lifecycle for production circuit card assemblies (CCAs) and integrated RF systems.

On any given day, the selected candidate may be asked to perform the following:

  • Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets.
  • Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders).
  • Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity).
  • Perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance.
  • Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor.
  • Run formal design reviews, drive closure of action items, and maintain design histories, BOMs, and ECOs through PLM.
  • Own fab and assembly drawing packages, stack-up notes, controlled impedance requirements, coupons, panelization, and testability features.
  • Collaborate with PCB fabs/CMs on builds (Class 3), negotiate tolerances, and resolve issues (mask alignment, plating thickness, impedance yield, lamination strategy).
  • Plan and execute board bring-up; define acceptance tests and interface with RF test for S-parameters, noise figure, PAE, ACPR/EVM, and linearity (P1dB/IP3/AM-AM/AM-PM).

·         Define, implement, and sustain acceptance tests for CCAs (Rx/Tx/control/power) with clear entry/exit criteria, coverage metrics, and pass/fail limits; maintain golden units and calibration artifacts.

·         Architect automated test sequences (Python/LabVIEW/MATLAB or similar) for VNAs, spectrum analyzers, signal generators, power meters, oscilloscopes, and RF switch matrices; integrate data logging, serialization, and dashboards; manage version control and CI where appropriate.

 

Required Qualifications

  • Bachelor’s degree in electrical engineering or related engineering field.
  • 5+ years in RF/microwave and mixed-signal PCB development for high-reliability products.
  • Technical Depth:
    • Proven expertise in RF board layout for L/S/C/X/Ku/Ka-band front-ends (LNAs, PAs, switches, beamformers, PLL/synth, couplers/splitters).
    • Hands-on with hybrid stack-ups, controlled impedance design, backdrill/HDI strategies, and thermal/shielding practices.
  • Tools: Proficiency with one or more ECAD suites (Altium Designer, Cadence Allegro/OrCAD, Mentor/Xpedition) and analysis tools (Keysight ADS, Ansys HFSS/SIwave, CST).

·         Hands-on with RF measurements and analysis: S-parameters, gain/NF, linearity (P1dB/IP3), modulation metrics (EVM/ACLR), phase noise, timing/synchronization, PLL/synth chains, PA/LNA/mixer characterization.

·         Proficiency automating instruments and data pipelines (Python and/or LabVIEW; MATLAB a plus) using SCPI/IVI; experience with LAN/USB/GPIB control, data historians/MES, and dashboarding (e.g., Power BI/Tableau/SQL).

  • Working knowledge of IPC-2221/2223, IPC-6012, IPC-A-600/-610 Class 3, ANSI/ESD S20.20, environmental/EMI test practices (e.g., MIL-STD-810/461 as applicable), calibration traceability,+ and DoD documentation practices.
  • Ability to obtain a DoD Top-Secret/SCI clearance.

 

Desired Qualifications

  • Master’s degree preferred.
  • Experience delivering phased-array TR modules, beamforming IC integrations, or wideband front-ends in production.
  • Background in design for ruggedization and environmental screening (thermal cycling, vibe/shock) and reliability analysis (derating, FMEA).
  • Familiarity with PLM (e.g., Arena/Windchill), manufacturing with domestic CMs, and rapid RCCA/MRB/CCB processes.
  • Exposure to mmWave packaging, RF connectors/launches (SMPM/SMP/SEARAY/coax launches), and fixture design for S-parameter/over-the-air test.
  • Certifications (IPC CID/CID+), or equivalent PCB design credentials.
  • Excellent technical communication, supplier interaction, and concise documentation skills.
  • Track record leading cross-functional design efforts, running reviews, and mentoring engineers.
  • Active Secret or TS preferred.


Clearance Level

 

TS/SCI

The salary range for this role is:

$111,500 - $158,025

AeroVironment considers several factors when extending an offer, including but not limited to, the location, the role and associated responsibilities, a candidate’s work experience, education/training, and key skills.

ITAR Requirement:

This position requires access to information that is subject to compliance with the International Traffic Arms Regulations (“ITAR”) and/or the Export Administration Regulations (“EAR”). In order to comply with the requirements of the ITAR and/or the EAR, applicants must qualify as a U.S. person under the ITAR and the EAR, or a person to be approved for an export license by the governing agency whose technology comes under its jurisdiction. Please understand that any job offer that requires approval of an export license will be conditional on AeroVironment’s determination that it will be able to obtain an export license in a time frame consistent with AeroVironment’s business requirements. A “U.S. person” according to the ITAR definition is a U.S. citizen, U.S. lawful permanent resident (green card holder), or protected individual such as a refugee or asylee. See 22 CFR § 120.15. Some positions will require current U.S. Citizenship due to contract requirements.

Benefits:  AV offers an excellent benefits package including medical, dental vision, 401K with company matching, a 9/80 work schedule and a paid holiday shutdown.  For more information about our company benefit offerings please visit:  http://www.avinc.com/myavbenefits.

Principals only need apply.  NO agencies please.

About AeroVironment

Size
1,214 employees
Market Cap
$2 billion
Industry
Net Income
$29.8 million
Founded
1971
5 Year Trend
+13.8%
Revenue
$394.1 million
NASDAQ

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