Weare seeking a Process Engineer to join the Operations Engineering team. Thesuccessful candidate will drive safety, debug and troubleshoot complex backendsemiconductor processes, lead continuous improvement initiatives, and reactquickly to process abnormalities. They must be able to work independently andexercise sound judgment in dynamic production environments.
Your role
Key responsibilities in your new role
- Manufacturing Support: Maintain a visible presence on the production floor to support sustaining manufacturing activities and resolve day-to-day production issues
- Root Cause: Lead structured problem solving using 8D and related tools to identify and drive corrective actions to root cause
- Equipment Optimization: Partner with Equipment Engineering to improve equipment performance and develop robust preventive maintenance programs
- Continuous Improvement: Lead and implement CI projects using Lean and Six Sigma methodologies with hands-on application
- Data Analysis: Analyze process and equipment performance data to identify trends, failure modes, and reliability improvements
- Supplier Support: Collaborate with supplier quality and purchasing to address material/vendor issues impacting assembly and screening processes
- Initiative & Execution: Proactively identify improvement opportunities, take calculated risks, and manage execution to completion
Your profile
Qualifications and skills to help you succeed
- Education: Bachelor of Science in Mechanical, Chemical, Materials, Manufacturing, Electrical, or Electronics Engineering preferred
- Certifications: Desire to obtain Six Sigma Green Belt, familiarity with Lean tools preferred
- Technical Skills: Hands-on experience or aptitude for complex backend semiconductor equipment, equipment troubleshooting, and preventive maintenance
- Analytical Skills: Strong data analysis capability, familiarity with SPC and root cause methodologies
- Soft Skills: Self-starter, effective communicator, strong listener, able to multi-task and prioritize in a fast-paced environment
- Work Style: Comfortable in a dynamic manufacturing environment, willing to learn new tools and take ownership of issues
- Preferred Qualifications: Knowledge of backend semiconductor or electronic assembly processes and/or package engineering including hands-on package and process development for new products and familiarity with material characterization and qualification methods
- Eligibility: US citizen or permanent resident required for export-controlled documentation access
Salary pay information:LocationIndicative salary rangeLeominster, MA United StatesWage range that the company expects to pay for a qualified candidate:
US$ 70,000 - US$ 95,000
Salary rate will depend on the highest level of education completed.
