As a Central Product Integration Engineer, you will provide technical leadership across Micron's global network to drive yield, product quality, and successful New Product Introduction (NPI). Operating at the intersection of Test, Product, Yield, Front-End Manufacturing, and Packaging/BEOL integration, this role requires strong cross-functional collaboration and the ability to translate complex technical challenges into scalable, network-wide solutions. You will work closely with teams across the U.S., Japan, Taiwan, and Singapore to meet aggressive performance, quality, and reliability targets. Come join an amazing team! Key Responsibilities • Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products. • Integrate and drive execution of cross-site project data (design, test, yield, manufacturing) to closure. • Deliver yield improvements through end-to-end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements. • Define and execute strategies to ensure Packaging Technology and Chip-Package Interaction readiness ahead of product qualification. • Lead cross-functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best-known methods (BKMs) and business processes to improve productivity. • Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment. Minimum Qualifications • Bachelor's, Master's, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field. • 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration. • Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing. • Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills. • Ability to work independently in a cross-functional, global environment, manage multiple priorities, and travel 20-50%. Preferred Qualifications • Experience with DRAM High Bandwidth Memory (HBM) products. • Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip-package interaction, BEOL integration, or layout topics. • Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams. • Demonstrated ability to drive alignment and execution in central or network-level roles. • Strong interest in innovation, continuous improvement, and scalable solution development. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.