The RoleThis position performs finite element analysis for CScale optical engine packages across both thermal and structural domains. It is scoped for a strong FEA engineer: demonstrated depth in either thermal or mechanical analysis is expected, and the ability to work competently in the other is required.
Correlation against measured hardware is expected. Results are used for design sign-off, so assumptions must be documented and defensible.
ResponsibilitiesThermal analysis- Build and maintain thermal models spanning die, package, interface materials, lid, and cold plate, and establish cooling boundary conditions and their validity limits.
- Resolve the temperature field across the photonic IC to the resolution photonic design requires, and define the heat extraction path and interface material selection for high-flux die within the assembly.
Structural analysis- Predict warpage through the assembly process, and own the flatness, coplanarity, and facet planarity budgets that assembly and optical coupling depend on.
- Analyze bump and interconnect stress, chip-package interaction, and fatigue life, supporting qualification against JEDEC or equivalent methodology.
Methodology and correlation- Define modeling standards and document assumptions such that results are auditable.
- Lead correlation against measured temperature, warpage, cross-section, and reliability data, and revise methodology accordingly.
Design and supplier support- Provide requirements, constraints, and sign-off criteria during architecture definition rather than after design freeze.
- Engage substrate suppliers, OSATs, and cooling and material vendors on process assumptions and measured data.
Required Qualifications- MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background.
- 6+ years of finite element analysis for semiconductor packaging or electronic systems, including one product carried from architecture through hardware correlation.
- Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain - for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
- Sound FEA fundamentals: meshing judgment, boundary condition selection, convergence, and the ability to defend a model rather than only to run one.
- Demonstrated correlation of simulation against physical measurement, and the judgment to distinguish a modeling error from a process excursion.
- Experience with advanced packaging construction: flip chip, 2.5D/3D, interposers, and heterogeneous integration.
Preferred Qualifications- Depth in nonlinear and time-dependent material behavior: creep, viscoplasticity, viscoelasticity, and fatigue.
- Silicon photonics or optoelectronic packaging, including thermo-optic sensitivity or warpage as an optical alignment constraint.
- Coupled thermal-structural workflows, including transfer of a computed temperature field into a structural model.
- Direct-to-chip liquid cooling, or chip-package interaction and low-k dielectric stress.
- Scripting for model automation and parametric studies, and design of experiments methodology.
Scope and ImpactThis position provides the physics basis for package architecture decisions and qualification.
Compensation includes a base salary of $150,000-$250,000 and equity in CScale. Final offers depend on experience, market conditions and location.
