The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development - and in particular dicing, electrical probing, wirebonding, and flip chip bonding - who will aid in AWS's effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.
Key job responsibilities
- Lead the sustainment and development of die singulation, die preparation, and device probing.
- May need to support wirebonding, and flip chip bonding
- Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
- Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
- Analyze process data to identify trends, improve stability, and drive continuous yield improvement.
A day in the life
The schedule is late afternoon through late night for this role, 4pm-1am for example. The initial training will be performed in the day time. Once the training is finished, the candidate is expected to work independently in the assigned hours.
The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects.
Export Control Requirement Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility.
About the team
The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination.
The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.
BASIC QUALIFICATIONS
- 2+ years of technical support experience
- 2 years of direct microfabrication experience
- 2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment
- Excellent communication and writing skills
PREFERRED QUALIFICATIONS
- 2 years experience with one or more of the following: Saw Dicing, Electrical test (Probing), Wirebonding, Flip Chip Bonding
- 2 years working in microfabrication in a research and development setting
- Experience with developing new process and failure analysis activities
- Experience with data analysis and visualization tools
- Experience with inventory management and using a MES system
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, Pasadena - 74,700.00 - 130,700.00 USD annually
