Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field (PhD a plus).
12+ years of progressive hardware engineering experience in high-speed digital, mixed-signal, or analog systems.
At least 3+ years in a management role with a strong leadership presence.
Deep expertise in high-speed PCB design and multi-layer stack-ups.
Proven track record delivering complex hardware platforms from concept through volume production.
Hands-on experience with industry-standard EDA and SI tools and lab instrumentation.
Strong understanding of signal integrity, power integrity, and high-speed link analysis.
Responsibilities
Define and execute the hardware engineering roadmap aligned with product strategy.
Lead design and development of complex interconnect solutions for internal and customer needs.
Oversee high-speed PCB architecture, design, and analysis processes.
Drive rigorous board-level verification and characterization using advanced lab equipment.
Establish and improve design methodologies and simulation tool flows.
Build, mentor, and scale a high-performing hardware engineering team.
Collaborate cross-functionally to ensure seamless product integration and timely market delivery.
Engage directly with key customers and partners on technical requirements and solutions.
Manage project schedules, resources, and risks for multiple hardware programs.
Champion design quality and optimize for reliability and cost effectiveness.
Benefits
Career development and mentoring opportunities.
Opportunity to work with a multi-disciplinary high-performing team.
Access to advanced lab facilities and cutting-edge technology.
Involvement in high-impact projects in data center and networking sectors.
Full Job Description
Senior Manager/Director, Hardware Engineering
The Sr. Manager/Director of Hardware Engineering leads the hardware engineering organization within the business unit. This role is responsible for the architecture, design, development, validation, and production readiness of high-speed board-level hardware, reference designs, evaluation and validation platforms, and interconnect solutions that enable our analog ICs devices.
The ideal candidate builds and leads a multi-disciplinary team focused on high-speed PCB design, signal integrity (SI), power integrity (PI), system bring-up, and characterization while driving close collaboration with IC design, validation, applications, product marketing, and customers.
Key Responsibilities:
Define and execute the hardware engineering roadmap aligned with our product strategy for data center and optical/copper connectivity markets.
Lead the design and development of complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs.
Oversee high-speed PCB architecture, schematic capture, layout, SI/PI analysis, and design for manufacturing (DFM).
Drive rigorous board-level verification, bring-up, debug, and characterization using advanced lab equipment (VNA, TDR, high-speed oscilloscopes, BERTs, etc.).
Establish and continuously improve design methodologies, simulation tool flows (HyperLynx, SIwave, HFSS, ADS, etc.), and measurement best practices.
Build, mentor, and scale a high-performing team of hardware, SI/PI, and systems engineers; manage performance, career development, and technical excellence.
Partner closely with IC design, packaging, applications engineering, validation engineering, test engineering, signal integrity engineering, product marketing, and operations to ensure seamless product integration and time-to-market.
Engage directly with key customers and ecosystem partners on reference designs, technical requirements, and solution enablement.
Manage project schedules, resources, budgets, and risk for multiple concurrent hardware programs from concept through production release.
Champion design quality, reliability, EMI/EMC compliance, cost optimization and on time delivery
Oversee interactions with external vendors and plan for fabrication and assembly of boards to meet demands.
Job requirements (Minimum qualifications and Previous Relevant Work Experience, Key competencies required):
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field (PhD a plus).
12+ years of progressive hardware engineering experience in high-speed digital, mixed-signal, or analog systems, with at least 3+ years in a management role.
Deep expertise in high-speed PCB design, multi-layer stack-ups, differential signaling, SerDes interfaces (PCIe, Ethernet, PAM-4, etc.), signal integrity, and power integrity.
Proven track record delivering complex hardware platforms from concept through volume production in data center, networking, optical modules, or similar environments.
Hands-on experience with industry-standard EDA and SI tools (e.g., PADS/xDxDesigner, Allegro, HyperLynx, SIwave, HFSS, Keysight ADS) and high-speed lab instrumentation.
Strong understanding of transmission line theory, impedance control, crosstalk, jitter, and high-speed link analysis.
Demonstrated ability to lead cross-functional teams and influence technical direction in a fast-paced semiconductor environment.
Excellent communication, collaboration, and stakeholder management skills.
Familiarity with advanced packaging, thermal management, and high-density connector systems.
Familiarity with lab equipment (multimeter, oscilloscopes, VNAs)
