Date Posted:2026-09-14
Country:United States of America
Location:US-MA-TEWKSBURY-TB3 ~ 50 Apple Hill Dr ~ CONCORD BLDG, Tewksbury Tb3 300 Concord
Position Role Type:Onsite
U.S. Citizen, U.S. Person, or Immigration Status Requirements: Active and transferable U.S. government issued security clearance is required prior to start date. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Security Clearance Type: Top Secret - Current
Security Clearance Status: Active and existing security clearance required on day 1
Advanced Technology is seeking a multi-disciplinary Engineering Project Leader that is responsible for the strategy and development of a microelectronics packaging portfolio that includes the development and use of 2.5D and 3D heterogeneous integration (3DHI) to increase the functional density of RF and mixed-signal sub-systems.
In this role, a successful candidate will provide technical direction and expertise during new program capture and execution of Contract Research and Development (CRAD) programs, as well as working across the Raytheon enterprise to support further maturation and transition into operational programs. Additionally, you will identify strategic product development opportunities and propose/coordinate Independent Research and Development (IRAD) projects across programs and product lines. You will work closely with engineers across technical disciplines, and will be highly visible, influential, and accountable within Raytheon's programs and leadership community.
This position is onsite and can be located at Tewksbury, MA; McKinney, TX; or Goleta, CA.
What You Will Do- Work closely with the Senior Leadership and integrated functional teams to develop new business capture strategies and then lead the capture and management of the resulting projects.
- Perform regular customer interactions to develop strategic and emerging microelectronic packaging opportunities, white papers and proposals.
- Align the program teams to customer priorities through requirements development, mission analysis, shaping, and pre-design to provide clear direction and actively manage risk mitigation strategies and capture program opportunities.
- Lead trade studies to consider 2.5D and 3D integration strategies using monolithic and chiplet-based architectures to meet system needs.
- Lead/manage interposer fabrication and assembly strategy that spans multiple Raytheon manufacturing sites and 3rd party suppliers.
- Lead technical white papers and proposal volumes through cross-organizational collaboration to deliver customer-focused and high-scoring content.
- Guide, apprentice, mentor, and train employees within the RF, mixed-signal, system integration and packaging technical domains.
- Responsible for management and reporting of portfolio investment budget.
- Travel for customer engagements.
Qualifications You Must Have- Typically requires Bachelor's degree in Science, Technology, Engineering, or Mathematics (STEM) and minimum of 12 years of prior relevant experience.
- Experience with microelectronics design and development with emphasis on microelectronics packaging.
- Experience writing and/or leading responses to solicitations (RFIs, RFPs, etc.), including white papers and/or proposals.
- Experience managing program cost, schedule, and technical performance.
- Experience leading cross-functional teams including, but not limited to principal investigator, engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations.
- Active and transferable Top Secret U.S. government issued security clearance is required prior to start date with the ability to obtain a Top Secret/SCI clearance and/or program access after start.
Qualifications We Prefer- Experience in high-performance RF system design and high-performance mixed-signal systems.
- Expert knowledge in microelectronics packaging to include electrical, mechanical and thermal design constraints.
- Experience with state-of-the-art 2.5D and 3D microfabrication and assembly techniques.
- Experience across the full product development lifecycle.
- Demonstrated excellence in interacting with customers and decision makers
- Excellent communication ability in verbal, written and presentation formats
- Knowledge of Department of War and Intelligence Community operational concepts.
- Experience with capturing and executing programs within the Department of War and Intelligence Community Science and Technology organizations to include DARPA and the service laboratories.
- Familiarity with government acquisition process.
- 5+ years of experience successfully managing technology development programs and IRAD projects.
- Well-organized with the ability to prioritize and manage a high-mix workload (multiple projects at once).
- Ability to obtain Program Management (Level 4) and EV Certification.
- Advanced degree such as MS or PhD in physics, circuits, material science, mechanical engineering, or other related engineering field.
What We Offer- Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Safety, Trust, Respect, Accountability, Collaboration, and Innovation.
- Relocation eligible - Relocation assistance is available for this position.
Learn More & Apply Now!- This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm
- Raytheon's Advanced Technology Advanced Technology | Raytheon
- We Are RTX
As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote.The salary range for this role is 157,200 USD - 298,800 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate's work experience, location, education/training, and key skills.
Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.
Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company's performance.
This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply.
RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window.
