Job Description
Join a team developing high-performance analog and mixed-signal ICs for CMOS image sensor applications. You’ll turn transistor-level designs into robust silicon layouts, balancing matching, noise, area, reliability, and manufacturability.
If you enjoy solving layout-dependent performance challenges and collaborating closely with analog designers from schematic through tapeout, this role offers meaningful technical depth within Teledyne Technologies.
What you’ll do
- Create transistor- and block-level layouts for Op-Amps, references, ADC/DACs, PLLs, sensor readout, and high-speed interfaces.
- Optimize floorplans for matching, area, noise isolation, power integrity, and EM reliability.
- Apply common-centroid, interdigitation, symmetry, shielding, guard-ring, and dummy-device techniques.
- Run and resolve DRC, LVS, ERC, density, and fill verification.
- Minimize parasitic coupling, process variation, and layout-dependent effects.
- Support parasitic extraction, post-layout simulation, and tapeout.
- Collaborate with design, process, reliability, verification, and CAD teams.
- Contribute to layout reviews and mentor junior engineers when appropriate.
What you need
- Required: Strong understanding of analog matching, parasitics, device physics, ESD, and reliability.
- Required: Ability to interpret transistor-level schematics and analog circuit behavior.
- Required: 3+ years of analog/mixed-signal IC layout experience.
- Required: Experience with advanced CMOS technologies and signoff.
- Required: Proficiency with Cadence Virtuoso and Calibre, Assura, or equivalent tools.
- Required: Bachelor’s or Master’s degree in EE, Computer Engineering, Physics, or related field.
- Advantage: CIS, ADC/DAC, PLL, high-voltage, or low-noise sensor-interface experience.
- Advantage: EM/IR, LDE, ESD/latch-up, advanced-node, and tapeout experience.
What we offer
- Technically challenging work on advanced sensor ICs.
- Collaboration across deep engineering disciplines.
- Opportunities to expand analog layout and silicon expertise.
- Exposure to designs from block level through integration and tapeout.
- The stability and engineering breadth of Teledyne Technologies.
What happens next
Applications are reviewed first, followed by a recruiter screen and technical/team interviews for selected candidates. Timelines vary by role and candidate availability.
Salary Range:
$93,700.00-$124,900.000
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
