Advanced Micro Devices, Inc

AI Automation Design Packaging Lead

Advanced Micro Devices, Inc • $120K — $160K *
Austin, TX 78745In-Person
Enterprise Technology
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • 5-7 years of experience in packaging design and automation
  • Strong knowledge of EDA packaging design tools (Cadence, Siemens, Synopsys)
  • Proven ability to develop automation using programming languages (Python, Tcl, SKILL, C++)
  • Experience applying AI/ML frameworks (PyTorch, TensorFlow) to design challenges
  • Familiarity with advanced packaging architectures (2.5D/3D, Chiplets)
  • Excellent leadership and collaboration skills
  • Bachelor's or Master's degree in Electrical Engineering or related field

Responsibilities

  • Drive development and maintenance of AI workflows for advanced packaging designs
  • Optimize design stages using AI/ML methodologies
  • Collaborate with EDA vendors on feature roadmap implementation
  • Lead transition to algorithmic design operational models
  • Coordinate closed-loop optimization with analysis teams
  • Prepare Executive Summaries on automation ROI and tool advancements
  • Mentor junior engineers on coding practices and packaging concepts

Benefits

  • Comprehensive benefits package including healthcare and wellness programs
  • Opportunities for professional development and career growth
  • Flexible work environment with hybrid options
  • Collaborative and innovative team culture
  • Access to cutting-edge technology and tools
Full Job Description
THE ROLE:

We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:

The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.

KEY RESPONSIBILITIES:
  • Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
  • Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
  • Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
  • Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
  • Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
  • Mentoring junior engineers in coding best practices and advanced packaging concepts.


PREFERRED EXPERIENCE:
  • Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Proven track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Good leadership and interpersonal skills.


ACADEMIC CREDENTIALS:
  • Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.


This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

Work You’ll Do

At AMD, we offer job opportunities that push the boundaries of what is possible. Our team is composed of professionals who lead the way in microprocessor and graphics technology, driving industry standards and innovation. With AMD, you will be part of a culture that values growth and professional development, ensuring that every team member has the opportunity to excel.

Transform Your Career

AMD is not just about advancing technology, but also about advancing careers. Whether you are looking for an internship, a full-time position, or leadership roles, AMD provides the platform to propel your career to new heights. Our commitment to professional growth is matched by our dedication to diversity and inclusion, making AMD a place where everyone can thrive.

Innovative Work Environment

Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

Career Development and Benefits

AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

Explore Job Opportunities

From engineering to marketing, AMD offers a range of career paths that cater to diverse skills and interests. Our hiring process is designed to be transparent and engaging, helping you to understand where you fit within our team and how you can contribute to our collective goals.

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Interview and Resume Tips

Prepare for your future with AMD by accessing resources that help you craft your resume and excel in interviews. Our goal is to help you showcase your best professional self and align your skills with the needs of our dynamic team. At Advanced Micro Devices, Inc., we empower our employees to innovate, lead, and grow. Join us in driving the future of technology while building a rewarding and sustainable career.
Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Manufacturing & Automotive
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ
AMD
* Ladders Estimates

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