Qualifications
Responsibilities
Benefits
Summary of Role:This advancedpackaging process integration engineering role will leadpostFab process development to meet customer requirements.The candidate will have a strong focus onwafer finishing and assemblyprocesses tosupport silicon photonicsand otherproduct lines.
Essential Responsibilities:
Leadpackagingprocess development efforts and planning by working with the unit process engineersanddirectly with tools & materialssuppliersforadvancedpackaginginBurlington,VT(Fab9).
Drivesemiconductor processdevelopment inCMP, wafer thinning, and dicing.Collaborate withunit process engineersto developnew processesforadvanced packaging roadmaps.
Lead next generation packaging and assemblydevelopment to support different product needs.Partner with internal design,fabricationand packaging teams toset assemblyspecs/requirementsanddrive new assemblyflow/processdevelopment.
Driveunderstandingoffailuremodesandworkwithcrossfunctional teams toidentifyandresolve technicalissues.
Adopt design for costmethodologyto enable continuous improvement projects.
Generate IP related to novel wafer integration & packaging technology.
Drive end-to-end process integration and planning to enable new capability planning, early productprototypingand qualification across multiple programs.
Developexpertisein processes,materialsandtooling toleverageavailable characterization resources.
Collaborate with OSATs (Outsourced Assembly and Test) to develop newpackagingintegration processes.
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.
Other duties as assigned bythe manager.
Required Qualifications:
Education 6PhDin Electrical Engineering, Mechanical Engineering, Chemical Engineering, MaterialsScienceorrelatedfieldsfrom an accredited degree program.
At least 15years of prior related work experienceinwafer finishing(thinning, dicing,bumping, andRDL)and assembly processes.
Language Fluency - English (Written & Verbal).
Travel - Up to 10%.
Preferred Qualifications:
Experience in bringing packaged products from development into production.
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Project management skills,i.e.the ability to innovate andexecutesolutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills.
Strong planningand organizationalskills.
Expected Salary Range
$143,000.00 - $247,000.00The exact Salary will be determined based on qualifications, experience and location.
Our team will look into this right away.
