Join the Photonics Platform Business Group within the CTO Office at Applied Materials' Santa Clara headquarters, where you will work with a world-class research team developing next-generation silicon photonics packaging technologies. This role focuses on enabling high-performance optical interconnects and co-packaged optics through innovative advanced packaging and 3D integration solutions. As an Advanced Packaging Integration Engineer, you will lead process integration for high-performance interconnects and microLED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, substrate and connector suppliers, and cross-functional teams across Applied Materials and external partners. You will work closely with design, process, packaging, and metrology teams to deliver production-ready solutions. Key Responsibilities • Define, develop, and optimize advanced packaging process integration flows (e.g., 3D heterogeneous integration, die stacking, hybrid bonding) to achieve best-in-class performance, yield, and reliability. • Lead and manage complex technical programs, drive schedules, resolve technical challenges, and ensure on-time, high-quality deliverables. • Design controlled experiments, collect and interpret data, perform root-cause analysis, and implement corrective actions. • Collaborate with foundries, OSATs, and Applied Materials research teams to define and implement improved integration methodologies. • Track industry and competitive advancements and strategically apply new knowledge to drive innovation. Qualifications • M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM discipline. • In-depth knowledge and hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. • Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams. • Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP). Coding experience is a plus. • Experience with MES systems is a plus. • Ability to prepare clear, compelling executive-level or customer-facing presentations is a plus. • Self-starter with strong problem-solving skills; able to work both independently and in team environments with minimal supervision. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.