Advanced Micro Devices, Inc

3rd Party IP Technical Lead

Advanced Micro Devices, Inc$110K — $130K *
Consumer Technology
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5-7 years of experience in high-speed mixed-signal IP design and integration.
  • Strong knowledge of high-speed I/O SerDes or Memory PHY architectures and general mixed-signal IP.
  • Familiarity with interface protocols such as HBM, LPDDR, DDR, PCIe, Ethernet, and USB.
  • Experience with FinFET technologies at 7nm or below.
  • Basic understanding of RTL and digital logic design is preferred.
  • Competence in Python and/or Perl and familiarity with UNIX environments is desirable.
  • Excellent problem-solving abilities and strong communication skills.

Responsibilities

  • Serve as the technical owner for selected third-party Memory/Serdes PHY and mixed-signal IP.
  • Lead the technical aspects of IP/PHY throughout the entire product lifecycle.
  • Collaborate with third-party IP vendors for design transfer and integration into AMD SoCs.
  • Partner with SoC integration teams to ensure IP quality across electrical and logical domains.
  • Drive architectural decisions considering performance, power, area, cost, and constraints.
  • Translate industry standards and customer requirements into specifications for silicon and PCB designs.
  • Support package and PCB design with signal and power integrity analysis and optimization.

Benefits

  • Comprehensive AMD benefits package.
  • Flexible working arrangements including hybrid options.
  • Opportunities for professional development and career growth.
  • Engaging work within a highly influential team in a leading tech company.
Full Job Description
Responsibilities

THE ROLE:

The candidate will join a highly visible and influential team of high-speed physical interface (PHY) and mixed signal IP experts tasked with integration and support of 3rd Party Memory/Serdes PHY and mixed signal IP across all AMD products.  The team works across a large swath of AMD integration and post-silicon teams as well as with IP vendors and AMD customers.

 

THE PERSON:

The ideal candidate is self-motivated to work independently as well as collaboratively with technical people across a variety of AMD and vendor/partner teams, and who thinks of herself/himself as a problem solver. 

 

RESPONSIBILITIES:

  • Serve as the AMD technical owner for selected third-party Memory/Serdes PHY and mixed-signal IP across multiple product programs.
  • Provide technical leadership for the IP/PHY throughout the product lifecycle, from architecture --> integration --> post-silicon validation --> production.
  • Collaborate directly with third-party IP vendors to support IP evaluation, design transfer, release collateral, and integration into AMD SoCs; working closely with the Technical Project Manager.
  • Partner with SoC integration teams to ensure electrical, logical, and physical quality of IP integration.
  • Drive system-level architectural decisions by balancing performance, power, area, cost, and implementation constraints.
  • Interpret industry standards and customer requirements, translating them into silicon, package, PCB, and validation specifications.
  • Support package and PCB design teams with signal integrity and power integrity analysis, debug, and optimization; Partnering with SI/PI experts within AMD.
  • Evaluate new PHY and mixed-signal IP technologies for licensing and adoption.
  • Partner with post-silicon validation teams in directing first-silicon bring-up, debug, characterization, compliance testing, ATE production test support, and customer issue resolution.
  • Analyze post-silicon results and drive improvements to future PHY architectures, design methodologies, and IP development processes.
  • Provide technical guidance across the hardware development lifecycle, leveraging understanding of transistor-level design, system architecture, and SoC integration.

 

 

PREFERRED EXPERIENCE:

  • Strong experience designing high-speed mixed-signal IP, ideally with system-level architecture experience. Should have breadth of knowledge across the full IP hardware development process (or strong interest in developing it) and experience with integration IP into an SOC
  • Design knowledge of high-speed I/O SerDes or Memory PHY architectures and blocks, plus general mixed-signal IP, e.g. CTLE, FFE, DFE, VGA, CDR, PLL/DLL, TX driver, EMC, GPIO, etc.
  • Experience with one or more interface protocols like HBM, LPDDR, DDR, GDDR, PCIe, Ethernet, USB, DisplayPort, HDMI, MIPI etc. is preferred.
  • Experience with advanced FinFET semiconductor technologies at and below 7nm.
  • Basic understanding of RTL, logic design, and digital circuits
  • Python and/or Perl programming desirable.  Should be familiar with UNIX environment.
  • Laboratory experience, including hands-on use of equipment: BERT, oscilloscope, logic analyzer, etc. desirable.
  • Strong analytical/problem solving skills, ability to learn quickly, and attention to detail.
  • Good teamwork and oral and written communications skills are critical.

 

ACADEMIC CREDENTIALS:

  • B.S. or M.S. Electrical Engineering preferred

 

LOCATION:

  • Markham, Ontario, Canada ( Open to Vancouver, BC and Ottawa,ON)

 

#LI-SL3

#LI-HYBRID 

Qualifications

Benefits offered are described:  AMD benefits at a glance.

 

This posting is for an existing vacancy.

About Advanced Micro Devices, Inc

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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