Microsoft

Senior Quantum Package & Motherboard Engineer

Microsoft • $119K — $234K *
Redmond, WA 98052In-Person
Telecommunications & Hardware
Less than 5 years of experience
Today
Be an Early Applicant
Job Overview by Ladders

Qualifications

  • Doctorate in Physics or Engineering, with 1+ year industry experience, or equivalent experience.
  • Master's Degree in relevant field with 4+ years industry experience.
  • Bachelor's Degree in Physics or Engineering with 6+ years industry experience.
  • Proven ability to meet Microsoft security screening requirements; citizenship verification required.
  • Experience with artificial intelligence tools for innovation in hardware development.

Responsibilities

  • Develop and maintain design processes for quantum packaging and motherboards.
  • Drive solutions with external vendors for quantum device packaging.
  • Create PCB designs for cryogenic and quantum applications.
  • Simulate packaging components for signal and power integrity.
  • Own signaling chain specifications, from room temperature to cryogenic environments.
  • Enhance electrical and PCB development processes and frameworks.
  • Communicate effectively across technical and executive teams while mentoring junior engineers.

Benefits

  • Access to specialized security screenings required for employment.
  • Opportunity to work in an AI-first environment that fosters innovation.
  • Integration into a diverse and inclusive workplace culture.
Full Job Description
Responsibilities

  • Develop and maintain robust Package & Motherboard design processes for quantum devices. Document processes and implement across our global team.


  • Design & drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices.


  • Design & drive PCB designs to deliver solutions needed for cryo/quantum solutions.


  • Simulate Packaging/Motherboard components for Signal & Power Integrity.


  • Own signaling chain - including specifications, material / connector / cable definition from Room-Temperature to Cryo/Quantum temperature logic.


  • Develop and improve electrical and PCB development processes, documentation, quality frameworks, design review practices, design for manufacturing, testability, and validation workflows, manufacturing readiness processes, dashboards, and reporting mechanisms.


  • Communicate clearly across technical and executive audiences, synthesize engineering and supplier input into decision frameworks, influence outcomes without direct authority, and mentor junior engineering planning coordinators and engineers while reinforcing Microsoft's values and inclusive culture.


Qualifications

Required/Minimum Qualifications

  • Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position


    • OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment


    • OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment


    • OR equivalent experience.


Other Qualifications:

  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:


    • Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.


    • Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. a7 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.


  • Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation).


  • Ability to work in an 44;AI-first44; environment using modern AI tools to accelerate discovery through hardware development.


Additional or Preferred Qualifications

  • Bachelors or Masters Degree in Electrical Engineering or related field.
  • 10+ years design experience in Silicon Package Design and PCB Design.
  • Successfully delivered Silicon Packages and Motherboards into production.
  • Knowledge of industry standard tools/methodologies for Package and PCB Design.
  • Proficient in Analog Signal, Power Integrity & Signal Integrity simulations.
  • Self-starter with the ability to define and adhere to a schedule.
  • Good inter-personal skills, able to interface with a variety of external partners (customers, architects, designers, project managers, etc.) and are able to deliver complete layouts to customers.
  • Apply AI to accelerating Analog Layout execution times
  • Package, Motherboard, connector, cable designs at cryo temperatures
  • Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.


  • Apply AI to accelerating Analog Layout execution times


  • Package, Motherboard, connector, cable designs at cryo temperatures


  • Experience working directly with PCBs and/or superconducting integrated circuit design teams, fabrication vendors, electronics manufacturing services and contract manufacturers (EMS/CMs), and external suppliers.


Quantum Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800.00 - $234,700.00 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200.00 - $261,000.00 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

About Microsoft

Microsoft is an American multinational corporation that develops, manufactures, licenses, supports, and sells a range of software products and services. Microsoft’s devices and consumer (D&C) licensing segment licenses the Windows operating system and related software, Microsoft Office for consumers, and the Windows Phone operating system. The company’s computing and gaming hardware segment provides Xbox gaming and entertainment consoles and accessories, second-party and third-party video games, and Xbox Live subscriptions; surface devices and accessories; and Microsoft PC accessories. Its phone hardware segment offers Lumia smartphones and other non-Lumia phones. Its D&C segment provides Windows Store, Xbox Live transactions, and Windows phone store; search advertising; display advertising; Office 365 Home and Office 365 Personal; first-party video games; and other consumer products and services as well as operating retail stores. Microsoft’s commercial licensing segments license server products, including Windows Server, Microsoft SQL Server, Visual Studio, System Center, and related Client Access Licenses (CALs); Windows Embedded; Windows operating system; Microsoft Office for business, including Office, Exchange, SharePoint, Lync, and related CALs; Microsoft Dynamics business solutions; and Skype. Its commercial segment offers enterprise services, including premier support services and Microsoft consulting services; commercial cloud comprising Office 365 Commercial, other Microsoft Office online offerings, Dynamics CRM Online, and Microsoft Azure; and other commercial products and online services. The company markets and distributes its products through original equipment manufacturers, distributors, and resellers, as well as online.

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Learn more about Microsoft
Size
181,000 employees
Market Cap
$1,762.4 billion
Industry
Enterprise Technology
Net Income
$51.3 billion
Founded
1975
5 Year Trend
+15.5%
Revenue
$153.2 billion
NASDAQ
MSFT
* Ladders Estimates

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