Job Title: Principal Reliability/FA Engineer

Posting Start Date: 5/28/26

Job Location(s): Newbury Park

Requisition ID: 77684

Job Description:

Description

The Principal Reliability / Failure Analysis Engineer leads enterprise-level failure analysis across component, module, and system levels, serving as a technical authority shaping reliability strategy and execution. This role provides technical leadership, ensuring rigorous root cause identification and driving corrective actions that improve product reliability at scale. The engineer leads complex laboratory investigations, develops advanced FA methodologies, and guides design-for-reliability practices across multiple programs.

Responsibilities include analyzing and communicating results to isolate device- and system-level failures, defining test strategies and FA control procedures, and ensuring alignment with company, customer, and regulatory requirements. The role also requires development of advanced analytical tools and predictive approaches to identify risks early in product development, packaging, and manufacturing processes. Findings enable cross-functional decisions, guiding design, material, and process improvements to enhance long-term system reliability. This position also leads organization-wide corrective and preventive actions and mentors engineers, requiring exceptional technical depth, strategic thinking, and the ability to influence across teams to drive reliability excellence and continuous improvement.

Responsibilities

Lead comprehensive failure analysis investigations through data-driven approaches, troubleshooting electronic components including semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate fault isolation and root cause determination, leveraging deep knowledge of digital CMOS and HBJT RF technologies. Develop and deploy advanced failure analysis techniques to address emerging challenges.

Provide technical leadership to design, quality, and test engineering teams, guiding design-for-reliability decisions. Mentor engineers and technicians to strengthen technical capability and promote best practices. Lead cross-functional initiatives to enhance product robustness and accelerate resolution of critical failures. Prepare and deliver high-impact technical reports and recommendations to senior management and customers, ensuring alignment with business objectives and reliability standards.

Required Experience and Skills

Bachelor's degree in Electrical or Computer Engineering (or equivalent experience) with 12+ years of relevant experience, or a Master's degree with 10+ years in failure analysis and reliability engineering; PhD preferred.

Deep expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis, with a proven ability to lead complex investigations and develop innovative failure analysis methodologies.

Extensive hands-on experience with advanced FA tools, including CSAM, X-ray CT, IR/NIR microscopy, and wet and dry etching decapsulation techniques.

Strong proficiency in PCB and IC design tools, along with DC and RF parametric test equipment.

Broad technical knowledge spanning failure mechanisms, reliability physics, and materials science, complemented by solid statistical analysis and reliability modeling skills.

Excellent analytical, problem-solving, and communication abilities, with a demonstrated capacity to influence technical decisions and drive cross-functional collaboration at senior levels.

Proficiency in Microsoft Office applications, including Outlook, Word, Excel, and PowerPoint.

Desired Experience and Skills

Desirable qualifications include experience with advanced failure analysis tools such as SEM and FIB, along with familiarity in digital and RF test equipment and measurement techniques. A strong understanding of semiconductor fabrication processes-particularly silicon and GaAs technologies, including etching, photolithography, and dielectric processes-is highly valued, as is experience in mechanical polishing and sample preparation.

Knowledge of IC packaging technologies (e.g., wire bond, flip-chip, molding) is preferred, with exposure to advanced packaging and emerging materials considered a plus.

The ideal candidate demonstrates the ability to lead strategic initiatives, develop innovative analytical approaches, and influence design improvements through data-driven insights. This role requires strong technical leadership, proven mentorship, and the ability to effectively influence cross-functional teams. The candidate should be recognized as a subject matter expert, capable of independently solving complex, ambiguous problems while driving broad organizational impact. A positive attitude, adaptability, and strong collaboration skills are essential.

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The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.